Vibration Analysis of Laminated and Stepped Circular Arches by a Strong Formulation Spectral Collocation Approach
Vibration Analysis of Laminated and Stepped Circular Arches by a Strong Formulation Spectral Collocation Approach
复制标题
采用强公式谱搭配方法对叠层和阶梯式圆拱进行振动分析
DOI：
10.1142/s1758825116500368
复制
发表时间：
2016-05
影响因子：
3.5
通讯作者：
Yang, Haosen
中科院分区：
文献类型：
--
作者：
Xie, Xiang;Zheng, Hui;Yang, Haosen
提出了一种基于强公式的谱配置方法，用于研究任意边界条件、甚至满环的叠层和阶梯拱的静力学和自由振动。理论模型考虑了剪切变形、转动惯量和深度项的影响。这种方法的基本概念是用所采用的基函数来展开控制方程中出现的最高导数，而不是解函数本身。然后通过积分得到低阶导数和函数本身。积分过程中产生的常数由给定的边界条件决定。由于逼近过程基于积分技术，而不是传统的微分法，因此不要求基函数是可微的或连续的，这使得基函数的选择相当自由。用Haar Wavel方法评价了该方法对不同基函数应用的稳健性。
A strong formulation-based spectral collocation approach is presented to investigate the statics and free vibrations of laminated and stepped arches with arbitrary boundary conditions even full rings. The influences of shear deformation, inertia rotary and deepness term are considered in the theoretical model. The basic concept of the present approach is the expansion of the highest derivatives appearing in the governing equations instead of solution function itself by adopted basis functions. Then lower order derivatives and function itself are obtained by integration. The constants arising from the integrating process are determined by given boundary conditions. Due to the approximation process based on integration technique rather than conventional differentiation, it does not require the basis function to be differentiable or continuous, which makes the choice of basis functions quite freely. The robustness of the approach for the application of various basis functions is evaluated by using Haar wavel...
登录
查看更多内容
影响因子：
4.7
作者：
P. Raveendranath;G. Singh;B. Pradhan
通讯作者：
P. Raveendranath;G. Singh;B. Pradhan
影响因子：
6.3
作者：
S. Kapuria;P. C. Dumir;N. Jain
通讯作者：
S. Kapuria;P. C. Dumir;N. Jain
影响因子：
4.7
作者：
P. Malekzadeh;A. Setoodeh;E. Barmshouri
通讯作者：
P. Malekzadeh;A. Setoodeh;E. Barmshouri
影响因子：
3.6
作者：
A. A. Khdeir-A.;J. Reddy
通讯作者：
A. A. Khdeir-A.;J. Reddy
影响因子：
4.7
作者：
X. Tong;N. Mrad;B. Tabarrok
通讯作者：
X. Tong;N. Mrad;B. Tabarrok