Low-Cost, Ambient-Dried, Superhydrophobic, High Strength, Thermally Insulating, and Thermally Resilient Polybenzoxazine Aerogels
Low-Cost, Ambient-Dried, Superhydrophobic, High Strength, Thermally Insulating, and Thermally Resilient Polybenzoxazine Aerogels
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DOI：
10.1021/acsapm.9b00408
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发表时间：
2019-09-01
影响因子：
5
通讯作者：
Lu, Hongbing
中科院分区：
文献类型：
--
作者：
Malakooti, Sadeq;Qin, Guoqiang;Lu, Hongbing
一个家庭的环境干燥聚苯并恶嗪气凝胶制备与一个简单的和可扩展的过程作为一个高性能的聚合物气凝胶在高温下具有强大的和强大的热机械性能。这些材料在整个堆积密度范围内（0.24-0.46 g cm（-3））具有固有的阻燃性和超疏水性。此外，它们具有机械强度（例如，1 MPa，在室温下0.24 g cm（-3）），比具有类似密度的其他高性能气凝胶（包括聚酰亚胺和聚酰胺（类凯夫拉）气凝胶以及聚合物交联的X-二氧化硅和X-氧化钒气凝胶）的那些高，并且成本显著降低。此外，与大多数其他玻璃态聚合物材料不同，合成气凝胶的最大强度出现在略高于室温（约50 ℃）的使用温度下，这消除了在所有密度下强度相对于高达150 ℃的室温强度的任何下降的可能性。在较高的温度下（高达250摄氏度），这些气凝胶的整体性能也是稳定和坚固的，而杨氏模量或强度水平没有任何显着下降，这使得它们适用于各种工业应用，包括高性能结构和热保护应用，作为更昂贵的聚酰亚胺的替代品。
A family of ambient-dried polybenzoxazine aerogels is prepared with a facile and scalable process as a high-performance polymeric aerogel with strong and robust thermomechanical properties at elevated temperatures. Those materials are inherently flame-retardant and superhydrophobic over the entire bulk density range (0.24-0.46 g cm(-3)). In addition, they are mechanically strong with strengths (e.g., 1 MPa at 0.24 g cm(-3) at room temperature) higher than those of other high-performance aerogels of similar density, including polyimide and polyamide (Kevlar-like) aerogels as well as polymer-cross -linked X-silica and X-vanadia aerogels, at a significantly lower cost. Furthermore, unlike most other glassy polymeric materials, the maximum strength of the synthesized aerogels occurs at service temperatures slightly higher than room temperature (about 50 degrees C), which eliminates the possibility of any drop in strength with respect to the room temperature strength up to 150 degrees C at all densities. At higher temperatures (up to 250 degrees C), the overall performance of those aerogels is also stable and robust without any significant drop in Young's modulus or strength levels, which makes them suitable for various industrial applications including high-performance structural and thermal protection applications as an alternative to the significantly more expensive polyimides.