Redox and transport behaviors of Cu(I) ions in TMHA-Tf2N ionic liquid solution
Redox and transport behaviors of Cu(I) ions in TMHA-Tf2N ionic liquid solution
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DOI：
10.1007/s10800-006-9262-4
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发表时间：
2007-03-01
影响因子：
2.9
通讯作者：
Awakura, Yasuhiro
中科院分区：
文献类型：
--
作者：
Katase, Takuma;Murase, Kuniaki;Awakura, Yasuhiro
用微圆盘电极研究了单价铜在氨酰亚胺类离子液体--三甲基-正己基双((三氟甲基)磺酰基)胺(TMHA-Tf2N)中的氧化还原和迁移行为，以阐明其在电镀等方面的适用性。结果表明，在50℃时，铜(I)离子在含12 mmoldm(-3)的TmHA-Tf_2N中的扩散系数为1.2×10~(-6)cm~(-2)·S(~(-1))，其氧化还原电位范围为0.1~0.2V vs.I~-/I~(-3)。由于离子液体的高粘度，其扩散系数比水溶液中的小一个数量级。铜离子的扩散系数随温度升高而增大，112℃时扩散系数为1.0×10~(-5)cm~(-2)·S~(-1)，与常温下铜离子在CuSO_4水溶液中的扩散系数相当。这是由于离子液体溶液的粘度随温度的升高而急剧下降所致。在离子液体溶液中的扩散活化能为39kJ·mol(-1)。
The redox and transport behavior of monovalent copper species in an ammonium imide-type ionic liquid, trimethyl-n-hexylammonium bis((trifluoromethyl)sulfonyl)amide (TMHA-Tf2N) were examined with a micro-disc electrode to clarify its applicability to, for example, electroplating. It was found that the diffusion coefficient of Cu(I) ions in TMHA-Tf2N containing 12 mmol dm(-3) Cu(I) ions was 1.2 x 10(-6) cm(2) s(-1) and the redox potential of Cu(I)/Cu was in the potential range 0.1-0.2 V vs. I-/I-3(-) at 50 degrees C. The diffusion coefficient was one order smaller than that of Cu(II) ions in aqueous solution due to the high viscosity of the ionic liquid. The diffusion coefficient of Cu(I) ion increased with rising temperature and was 1.0 x 10(-5) cm(2) s(-1) at 112 degrees C, which was comparable to that of Cu(II) ions in aqueous CuSO4 solutions at ambient temperature. This is accounted for by the drastic decrease in the viscosity of the ionic liquid solution with increasing temperature. The activation energy of diffusion was estimated to be 39 kJ mol(-1) in the ionic liquid solution.