Fabrication of SERS Substrates by Roll-to-Roll Hot Embossing
Fabrication of SERS Substrates by Roll-to-Roll Hot Embossing
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通过卷对卷热压印制造 SERS 基底
DOI：
10.1007/978-94-024-0850-8_55
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发表时间：
2018
期刊：
影响因子：
--
通讯作者：
Lemmer U.
中科院分区：
文献类型：
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作者：
Habermehl A;Eschenbaum C;Lemmer U.
表面增强拉曼光谱（Sers）将拉曼散射的高特异性与由于金属纳米结构对电磁场的增强而引起的高灵敏度相结合。已经使用多种微米和纳米结构化方法来制造SERS结构[1-3]。我们提出了一种通过卷对卷（R2 R）热压印来创建增强纳米柱阵列[4]并用金层将其功能化的方法。R2 R热压工艺的原理如图55.1所示。该装置主要包括两个旋转的圆柱体（一个是微米或纳米结构的），它们可以相互挤压，并额外加热到超过其间聚合物箔的玻璃化转变温度。压花参数主要决定结果[5]。我们研究了压印温度和压力的影响。通过确定的参数设置，我们可以显示纳米柱的均匀转移，如图55.1所示。在Sers基底和非结构化参考基底上对分析物罗丹明6 G（Rh 6 G）进行拉曼测量的设置和结果如图55.2所示。在接下来的步骤中，可以通过制造用于微结构和纳米结构的一个母版将该Sers衬底集成到微流体芯片中。我们的工作显示了一种低成本制造的定制传感器芯片的Sers分析。
Surface-enhanced Raman spectroscopy (SERS) combines the high specificity of Raman scattering with a high sensitivity due to an enhancement of the electromagnetic field by metallic nanostructures. Multiple micro- and nanostructuring methods have been used to fabricate SERS-structures [1–3]. We present an approach to create enhancing arrays of nanopillars [4] by roll-to-roll (R2R) hot-embossing and to functionalize them with a gold layer. The R2R hot embossing process is shown in principle in Fig. 55.1 on the left. The setup mainly consists in two rotating cylinders (one micro- or nanostrcutured) that can be pressed against each other and additionally heated up to exceed the glass transition temperature of the polymer foil in between. The embossing parameters mainly determine the results [5]. We have investigated the influence of the embossing temperature and pressure. With the identified parameter setting we can show the uniform transfer of the nanopillars like shown in Fig. 55.1 on the right. The setup and the result of a Raman measurement of the analyte rhodamine 6G (Rh6G) on a SERS substrate and an unstructured reference substrate is shown in Fig. 55.2. In a following step this SERS substrate can be integrated into a microfluidic chip by manufacturing one master for the microstructure and the nanostructures. Our work show a way to a low cost fabrication of tailor-made sensor chips for SERS analyse.