Degradation of flip‐chip‐on‐glass interconnection with ACF under high humidity and thermal aging
Degradation of flip‐chip‐on‐glass interconnection with ACF under high humidity and thermal aging
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DOI：
10.1108/09540910210427826
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发表时间：
2002-08
影响因子：
2
通讯作者：
C. L. Wu;M. Chau
中科院分区：
文献类型：
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作者：
C. L. Wu;M. Chau
本文提出了使用玻璃芯片 (COG) 技术对粘合接头进行可靠性评估，该技术通过在不同的老化温度和高湿度下测试样品来进行。老化温度的范围考虑了粘合膜的玻璃化转变温度 (Tg)。通过剪切测试和微观结构检查评估了高温和高湿对倒装玻璃接点粘合强度的影响。结果发现，当老化温度低于ACF的玻璃化转变温度时，老化通常会导致剪切强度下降。当老化温度略高于 ACF 的 Tg 时，观察到剪切强度显着下降。此外，扫描电子显微镜的结果显示，元件凸块附近存在一些空隙，导致高老化温度下的高应力。 DSC 结果表明，ACF 未完全固化，吸湿性比完全固化的 ACF 更严重，导致接缝退化。
This paper presents a reliability assessment of adhesive joints using chip‐on‐glass (COG) technology which was conducted by testing samples at various aging temperatures and at high humidity.The range of aging temperatures took into account the glass transition temperature (Tg) of the adhesive films. The effects of high temperature and high humidity on the bond strength of flip‐chip‐on‐glass joints were evaluated by shear testing as well as by microstructural examination.It was found that aging generally caused a decrease in shear strength while the aging temperature was below the glass transition temperature of ACF. When the aging temperature was slightly above the Tg of the ACF, a significant decrease in shear strength was observed. Moreover, results from scanning electronic microscopy revealed the presence of some voids near the component bumps, resulting in high stresses at the high aging temperature. DSC results showed that the ACF was not fully cured, allowing moisture absorption more seriously than a fully cured ACF, leading to joint degradation.