Size effect on microstructure and tensile properties of Sn3.0Ag0.5Cu solder joints
Size effect on microstructure and tensile properties of Sn3.0Ag0.5Cu solder joints
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尺寸对Sn3.0Ag0.5Cu焊点显微组织和拉伸性能的影响
DOI：
10.1007/s10854-017-7706-8
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发表时间：
2017
期刊：
影响因子：
--
通讯作者：
Long X.
中科院分区：
文献类型：
--
作者：
Wang S.B.;Yao Y.;Long X.
在当前的研究中，研究了尺寸对Sn3.0Ag0.5Cu（SAC305）焊点微观结构和拉伸性能的影响。对厚度从 50 μm 到 2 mm 的焊点进行了实验。研究发现焊点的金属间化合物 (IMC) 生长速率取决于焊点的尺寸。焊接过程后，较小尺寸焊点的 IMC 比较大尺寸焊点的 IMC 更薄。研究还发现，IMC 的平均晶粒尺寸随着接头尺寸的减小而增大。为了更好地了解固态和液态热老化过程中 IMC 生长的差异，分别在 210 和 300 °C 下进行了实验。测量 210 和 300°C 热老化后焊点的 IMC 厚度。研究发现，固态和液态时尺寸对IMC生长速率的影响是不同的。在固态热老化下，较小尺寸焊点的 IMC 增长率高于较大尺寸焊点。在液态反应下，较小尺寸焊点的IMC生长速度较慢。在 2 毫米和 1 毫米厚度尺寸的焊点中分别观察到 Cu6Sn5 的“H”型和六角棱柱体。在 50 μm 厚的焊点中发现了较少的 Cu6Sn5 棱柱体。测量了不同尺寸焊点的拉伸强度。随着焊点厚度的减小，焊点呈现出韧性断裂到脆性断裂的转变。采用H场断裂准则预测不同厚度Sn3.0Ag0.5Cu焊点的抗拉强度。
In the current study, the size effect on microstructure and tensile property of Sn3.0Ag0.5Cu (SAC305) solder joint is investigated. Experiments were performed to solder joints with thickness from 50 μm to 2 mm. The intermetallic compound (IMC) growth rate of solder joints is found to be dependent on the size of solder joints. After soldering procedure, the IMC of smaller size solder joints is thinner than that of larger size solder joints. It is also found that the average grain size of IMC increases with decreasing of the joint size. To better understand the difference of IMC growth during solid-state and liquid-state thermal aging, experiments were performed at 210 and 300 °C, respectively. IMC thickness of solder joints after 210 and 300 °C of thermal aging was measured. It is found that the size effect on IMC growth rate at solid-state and liquid-state is different. The IMC growth rate of smaller size solder joints is higher than larger size solder joints under solid-state thermal aging. Under liquid-state reaction, the IMC growth rate of smaller size solder joints is slower. ‘H’ type and hexagonal prism of Cu6Sn5were observed in 2 and 1 mm thickness size solder joint, respectively. Fewer Cu6Sn5prism was found in 50 μm thickness solder joints. Tensile strengths of solder joints with different sizes were measured. The solder joints showed ductile to brittle fracture transition with the decreasing of joints thickness. TheH-field fracture criterion is employed to predict the tensile strength of Sn3.0Ag0.5Cu solder joints with different thickness.