Pluggable Electro-Optical Circuit Board Interconnect Based on Embedded Graded-Index Planar Glass Waveguides
Pluggable Electro-Optical Circuit Board Interconnect Based on Embedded Graded-Index Planar Glass Waveguides
复制标题
基于嵌入式渐变折射率平面玻璃波导的可插拔电光电路板互连
DOI：
--
复制
发表时间：
2015
影响因子：
4.7
通讯作者：
Andrew Cole
中科院分区：
文献类型：
--
作者：
R. Pitwon;L. Brusberg;H. Schroder;S. Whalley;Kai Wang;Allen M. Miller;Paul Stevens;A. Worrall;Alessandro Messina;Andrew Cole
基于嵌入式玻璃波导技术的电光电路板的广泛采用将实现从外部光纤网络到系统嵌入式光学互连架构的无缝光学连接。在本文中，我们报告了基于两步热离子交换工艺的薄玻璃箔内的平面多模波导的制造。开发了新型层压技术，以允许玻璃波导面板可靠地集成到传统的电子多层印刷电路板中。此外，还开发了一整套光连接器技术，以实现直接光纤到板和板到板连接。我们提出了一个完全集成的连接平台的设计，开发和表征，包括一个281×233 mm 2的多层电光背板集成平面玻璃波导，一个可插拔连接器系统，和五个可插拔测试卡。卡上和外部生成的850和1310 nm光测试数据都通过连接器和波导系统传输，并以每个通道高达32 Gb/s的数据速率表征系统内和系统到系统的光连接，误码率小于10-12。
Widespread adoption of electro-optical circuit boards based on embedded glass waveguide technology would enable seamless optical connectivity from external fiber-optic networks to system embedded optical interconnect architectures. In this paper, we report on the fabrication of planar multimode waveguides within thin glass foils based on a two-step thermal ion exchange process. Novel lamination techniques were developed to allow glass waveguide panels to be reliably integrated into a conventional electronic multilayer printed circuit board. In addition, a complete suite of optical connector technologies were developed to enable both direct fiber-to-board and board-to-board connectivity. We present the design, development, and characterization of a fully integrated connection platform, comprising a 281×233 mm2 multilayer electro-optical backplane with integrated planar glass waveguides, a pluggable connector system, and five pluggable test cards. Both on-card and externally generated 850 and 1310-nm optical test data were conveyed through the connector and waveguide system and characterised for in-system and system-to-system optical connectivity at data rates up to 32 Gb/s per channel exhibiting bit error rates of less than 10-12.