Solving Three Key Problems of Wavelet Transform Processor Using Surface Acoustic Wave Devices
Solving Three Key Problems of Wavelet Transform Processor Using Surface Acoustic Wave Devices
复制标题
利用声表面波器件解决小波变换处理器的三个关键问题
DOI：
10.1109/tie.2010.2041135
复制
发表时间：
2010-11-01
影响因子：
7.7
通讯作者：
Zhu, Changchun
中科院分区：
文献类型：
--
作者：
Lu, Wenke;Zhu, Changchun
在本文中，我们提出的体声波（BAW），声电回收（SER），和插入损耗的三个关键问题，小波变换处理器使用声表面波器件。本文针对这些问题提出了相应的解决方案。叉指换能器（IDT）的电极对数越多，激发的体声波越弱，因此当叉指换能器的电极对数足够大时，体声波可以被消除。小机电耦合系数（ECC）k（2）的衬底材料和IDT的低阻抗负载可以消除SER。当小波变换处理器的输出端分别连接到放大器时，可以补偿它们的插入损耗。X-112（0）Y LiTaO 3（小ECC k（2））被用作衬底材料以制造小波变换处理器。
In this paper, we present the bulk acoustic wave (BAW), the sound-electricity reclamation (SER), and the insertion loss as the three key problems of a wavelet transform processor using surface acoustic wave devices. The solutions to these problems are achieved in this study. The more the number of electrode pairs for the interdigital transducer (IDT) is, the weaker the excited BAW is, so the BAW can be eliminated when the number of electrode pairs for IDT is large enough. The substrate material of a small electromechanical coupling coefficient (ECC) k(2) and the low-impedance load of IDT can eliminate SER. When the output ends of the wavelet transform processors are respectively connected to the amplifiers, their insertion losses can be compensated. X-112(0)Y LiTaO3 (small ECC k(2)) is used as a substrate material to fabricate the wavelet transform processor.