Establishing a correlation between interfacial microstructures and corrosion initiation sites in Al/Cu joints by SEM–EDS and AFM–SKPFM
Establishing a correlation between interfacial microstructures and corrosion initiation sites in Al/Cu joints by SEM–EDS and AFM–SKPFM
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DOI：
10.1016/j.corsci.2013.10.039
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发表时间：
2014-02
影响因子：
8.3
通讯作者：
Madjid Sarvghad-Moghaddam;R. Parvizi;A. Davoodi;M. Haddad-Sabzevar;Amin Imani
中科院分区：
文献类型：
--
作者：
Madjid Sarvghad-Moghaddam;R. Parvizi;A. Davoodi;M. Haddad-Sabzevar;Amin Imani
采用搅拌摩擦焊方法制备了AA 3003与纯铜的搭接接头，并对接头界面进行了研究。采用SEM EDS、AFM、SKPFM、OM和维氏显微硬度等手段对界面区域进行了表征。多峰高斯分布（用于表征表面电位模式）显示了多种化合物的形成。微观结构成分和伏打电位分布之间的定量相关性被确认和腐蚀现场观察证实。据观察，富铝区域附近的分散的Cu颗粒和Cu-Al金属间化合物是最容易受到腐蚀攻击发起由于这些表面成分之间的电驱动力。
A lap joint of AA3003 and pure copper was produced by friction stir welding and the induced interfaces were investigated. Interfacial regions were characterized by SEM–EDS, AFM, SKPFM, OM and Vickers micro-hardness. Multimodal Gaussian distribution (for characterization of surface potential patterns) showed the formation of multiple compounds. A quantitative correlation between microstructure constituents and Volta potential distribution was recognized and confirmed by corrosion attacked sites observations. It was observed that the Al-rich regions proximate the dispersed Cu particles and Cu–Al intermetallics were most susceptible to corrosion attack initiation due to a galvanic driving force between these surface constituents.