High-spatial-resolution surface-temperature mapping using fluorescent thermometry
High-spatial-resolution surface-temperature mapping using fluorescent thermometry
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DOI:
10.1002/smll.200700581
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发表时间:
2008-07-01
期刊:
影响因子:
13.3
通讯作者:
Bergaud, Christian
中科院分区:
文献类型:
--
作者:
Loew, Peter;Kim, Beomjoon;Bergaud, Christian
The characterization of temperature and thermal properties is of particular importance in micro-and nanotechnology. Considering the highly increased density of structures and the increased power dissipation per unit area associated with miniaturization, good thermal design is of great importance for device reliability and performance. Locating hot spots, for example, on a microelectronic circuit, can be of great value in evaluating a design, optimizing the performance, and performing failure analysis.[1, 2] Apart from the industrial applications of micro-and nanoscale thermometry, fundamental questions of the thermal behavior, for example, thermal transfer at a scale comparable to the phonon wavelength,[3] could be more effectively addressed with improved characterization tools. The common approach for mapping temperature on the microscale is based on infrared microscopy, which relies on the analysis of the thermal radiation that is emitted from any material. IR microscopy is a well-established technique and can be used with relative ease for temperature mapping on large scales. However, the technique suffers from a diffractionlimited resolution, giving it an optimal spatial resolution of around 5 mm.[2, 4, 5] Nanoscale scientists typically use scanning thermal microscopy (SThM) for high-resolution measurements. Since the invention of the scanning probe microscope at the beginning of the 1980s,[6] several scanning probes for thermal characterization have been developed. The thermal probes used are generally based on either thermocouple or thermistor elements.[7–11] Other approaches have proposed bimaterial cantilevers or ffuorescent particles as temperaturesensing probes.[12–14] The highest spatial resolution obtained to this date using SThM lies below 50nm.[7] The main drawback with the scanning probes is the slow readout rate. In addition, the probes have to make contact with the sample and thereby provide a thermal bridge between the sample and the SThM equipment. Therefore, it is not obvious that the true sample temperature is measured. Other thermometry techniques typically found in the literature rely on Raman spectroscopy [15–17] and thermoreffectance microscopy.[18–21] Both are noncontact and noninvasive techniques that are capable of rendering submicrometer spatial resolution. Raman spectroscopy is well suited for the characterization of large temperature ranges from room temperature up to above 10008C. The spatial resolution is determined by its laser spot diameter, which can be as small as 500nm using a high-magnification objective.[16] Although it is capable of point measurements at very small timescales, the rendering of images is slow as it analyses only one point at a time at a slow acquisition rate of 0.5 points sÀ1.[22] Due to the low-energy phonon modes of metallic surfaces, Raman spectra are not suitable for the measurements of temperature on metals. Thermoreffectance microscopy relies on the fact that the surface reffectivity of any material depends on its temperature. By measuring how incoming light is reffected, temperature information can be extracted. The method can be applied either in the scanning mode or in the full-field mode. The scanning mode provides a superior temperature resolution but suffers from a slower readout rate. The main drawback with thermoreffectance microscopy is its tedious calibration process. The thermoreffectance coefficient, which has to be known for each material, is not readily available in the literature in most cases. Furthermore, the reffectance properties are sensitive to factors such as the illumination wavelength and, in the case of microelectronic devices, the …