Comprehensive Analysis on Hardware Trojans in 3D ICs: Characterization and Experimental Impact Assessment
Comprehensive Analysis on Hardware Trojans in 3D ICs: Characterization and Experimental Impact Assessment
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DOI：
10.1007/s42979-020-00220-0
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发表时间：
2020-07
期刊：
影响因子：
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通讯作者：
Zhiming Zhang;Jaya Dofe;Pruthvy Yellu;Qiaoyan Yu
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文献类型：
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作者：
Zhiming Zhang;Jaya Dofe;Pruthvy Yellu;Qiaoyan Yu
三维 (3D) 集成有助于将越来越多的晶体管集成到单个封装中。尽管性能和能效有所提高，但在同一封装中集成多个芯片可能会导致新的安全威胁，例如 3D 硬件木马。这项工作对 3D 集成电路 (IC) 和系统中报告的硬件木马进行了彻底调查，并提出了 3D 硬件木马的全面特征。通过几个案例研究来验证 3D 硬件木马实施的可行性。我们的实验结果表明，3D IC 确实比 2D IC 为插入隐秘热木马提供了更好的环境。利用多个 FPGA 板从概念上模拟遭遇多层硬件木马的堆叠 3D IC。所提出的多层木马的隐蔽性和有效性在我们的案例研究中得到了验证。仿真结果进一步表明，现有的基于自引用的针对2D木马设计的木马检测方法在3D场景下会导致检测率较低。
Three-dimensional (3D) integration facilitates to integrate an increasing number of transistors into a single package. Despite improved performance and power efficiency, the integration of multiple dies in the same package potentially leads to new security threats, such as 3D hardware Trojans. This work conducts a thorough survey on hardware Trojans reported in 3D integrated circuits (ICs) and systems, and proposes a comprehensive characterization of 3D hardware Trojans. Several case studies are performed to validate the feasibility of 3D hardware Trojan implementation. Our experimental results indicate that 3D ICs indeed provide a better environment for inserting stealthy thermal-based Trojans than 2D ICs. Multiple FPGA boards are utilized to conceptually emulate the stacked 3D ICs that experience multi-tier hardware Trojans. The stealthiness and effectiveness of the proposed multi-tier Trojans are validated in our case studies. The emulation results further show that the existing current-based self-referencing Trojan detection method designed for 2D Trojans will result in a lower detection rate in 3D scenarios.