Simulation based transistor-SRAM co-design in the presence of statistical variability and reliability

Simulation based transistor-SRAM co-design in the presence of statistical variability and reliability
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在存在统计变异性和可靠性的情况下基于仿真的晶体管-SRAM 协同设计

DOI:
10.1109/iedm.2013.6724741
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发表时间:
2013
期刊:
2013 IEEE International Electron Devices Meeting
影响因子:
--
通讯作者:
C. Alexander
C. Alexander
中科院分区:
--
文献类型:
--
作者:
A. Asenov;B. Cheng;X. Wang;A. Brown;D. Reid;C. Millar;C. Alexander

文献摘要

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我们报告了一项系统仿真研究,研究了工艺和统计变异性以及可靠性对 14 纳米技术节点 SOI FinFET 晶体管中 SRAM 单元设计的影响。开发了一种全面的统计紧凑建模策略,以便尽早交付具有内置统计变异性和可靠性信息的可靠 PDK。这使得基于 TCAD 的晶体管-SRAM 协同设计和新兴技术节点的路径查找成为可能。
We report on a systematic simulation study of the impact of process and statistical variability and reliability on SRAM cell design in a 14nm technology node SOI FinFET transistors. A comprehensive statistical compact modelling strategy is developed for early delivery of a reliable PDK with built-in statistical variability and reliability information. This enables TCAD-based transistor-SRAM co-design and path finding for emerging technology nodes.