Utilizing NaCl to increase the porosity of electrospun materials
Utilizing NaCl to increase the porosity of electrospun materials
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DOI：
10.1016/j.msec.2010.02.001
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发表时间：
2011-01-01
影响因子：
7.9
通讯作者：
Freeman, J. W.
中科院分区：
文献类型：
--
作者：
Wright, L. D.;Andric, T.;Freeman, J. W.
静电纺丝已经成为一种流行的方法，用于创建组织工程应用中使用的支架材料，以修复或替换受损组织。然而，为了成为可行的支架材料，电纺材料中的孔径必须增加以改善细胞浸润。利用静电纺丝过程中NaCl晶体的沉积来帮助克服这一障碍。NaCl晶体在旋转的收集心轴上方释放，并结合到聚（L-丙交酯）电纺材料中。然后NaCl从电纺材料中滤出，产生更大的孔：PLLA-NaCl电纺的平均孔径为48.7 μ m，而单独PLLA电纺的平均孔径为5.5 μ m。具有NaCl孔的电纺PLLA支架与其传统对应物（40.36 MPa、676 kPa和0.0188）相比具有较低的弹性模量（8.05 MPa）和屈服应力（349 kPa）以及较高的屈服应变（0.04）。降低弹性模量和屈服应力将有利于包括皮肤在内的弹性组织的组织工程化。NaCl孔的存在没有显著影响MC 3 T3细胞的细胞增殖，但确实允许细胞浸润到电纺材料中。因此，通过NaCl浸出产生大孔可以通过改善细胞浸润来显著改善用于组织工程应用的电纺材料的性能。(C)2010 Elsevier B. V.保留所有权利。
Electrospinning has emerged as a popular method for creating scaffolding materials used in tissue engineering applications to repair or replace damaged tissues. To become a viable scaffold material, however, pore sizes in electrospun materials must be increased to improve cell infiltration. Deposition of NaCl crystals during electrospinning was utilized to help overcome this obstacle. The NaCl crystals are released above the rotating collection mandrel and become incorporated into the poly(L-lactide) electrospun material. The NaCl then leaches out of the electrospun material creating larger pores: average pore diameter of 48.7 mu m for PLLA-NaCl electrospinning versus 5.5 mu m for PLLA alone electrospinning. Electrospun PLLA scaffolds with NaCl pores have a lower elastic modulus (8.05 MPa) and yield stress (349 kPa) and a higher yield strain (0.04) compared to their traditional counterparts (40.36 MPa, 676 kPa, and 0.0188). Decreased elastic modulus and yield stress would be beneficial to tissue engineering of elastic tissues including skin. The presence of NaCl pores did not significantly affect the cellular proliferation of MC3T3 cells but did allow for cell infiltration into the electrospun material. Therefore, the creation of large pores through NaCl leaching can significantly improve the performance of electrospun materials for tissue engineering applications by improving cellular infiltration. (C) 2010 Elsevier B.V. All rights reserved.