Developments in 2.5D: The role of silicon interposers
Developments in 2.5D: The role of silicon interposers
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2.5D 的发展：硅中介层的作用
DOI：
10.1109/eptc.2013.6745683
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发表时间：
2013
期刊：
影响因子：
--
通讯作者：
E. J. Vardaman
中科院分区：
文献类型：
--
作者：
T. Lenihan;L. Matthew;E. J. Vardaman
硅中介层是一种有着20多年历史的技术。如今，具有TSV的内插器被认为是3D IC结构的替代方案，在3D IC结构中，使用TSV将管芯堆叠在彼此的顶部上。具有TSV的中介层的应用包括用于网络应用的ASIC和FPGA。Xilinx的Virtex-7 2000 T FPGA是首批使用硅中介层和TSV进行分区IC设计的新产品之一。采用新封装技术的协同设计产生了一种新的FPGA，可以降低系统成本，提高性能，降低功耗。由于无需将片外I/O跨PCB走线驱动到相邻FPGA，因此以前使用多个FPGA的高性能应用可以被单个封装解决方案所取代，该解决方案可在FPGA芯片之间提供高带宽、低延迟、高能效的互连。性能提升的关键是将FPGA芯片划分为四个“切片”，并安装在硅中介层上。这是一个独特的应用，还是在GPU或ASIC应用中有其他潜在的应用？今天的中介层是无源结构，但有潜力的使用集成无源的中介层。这些应用程序与前几代引入的技术有何不同？本演示文稿重点介绍了引入硅内插器的新驱动因素。该演示文稿还探讨了支持该技术发展的基础设施的最新发展，包括供应商。本文还强调了采用当今的插入层和过去的硅上薄膜（MCM-D）之间的差异。
Silicon interposers are a technology with a history of multiple incarnations over more than 20 years. Today, interposers with TSVs are considered an alternative to 3D IC structures where die are stacked on top of each other using TSVs. Applications for interposers with TSVs include ASICs for networking applications and FPGAs. Xilinx's Virtex-7 2000T FPGA was one of the first new products using a silicon interposer with TSVs for a partitioned IC design. Co-design with new packaging technology has resulted in a new FPGA that allows reduced system cost and increased performance with lower power. By not having to drive off-chip I/Os across PCB traces to adjacent FPGAs, high-performance applications that have previously used multiple FPGAs can be replaced with a single package solution that provides high-bandwidth, low-latency, power-efficient interconnect between the FPGA die. The key to the performance gains is the partitioning of an FPGA die into four “slices” that are mounted on a silicon interposer. Is this a unique application or are there other potential applications for interposers in applications with GPUs or ASICs? Today's interposers are passive structures, but there are potential for the use of integrated passives in the interposer. How do these applications differ from the technology introduced in previous generations? This presentation highlights the new drivers for the introduction of silicon interposers. The presentation also examines the latest developments in the infrastructure to support the development of this technology, including suppliers. The article also highlights the differences between adoption of today's interposers and the thin-film on silicon (MCM-D) of the past.