Effects of Temperature and Structural Geometries on a Skyrmion Logic Gate
Effects of Temperature and Structural Geometries on a Skyrmion Logic Gate
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DOI：
10.1109/ted.2021.3130217
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发表时间：
2022-04
影响因子：
3.1
通讯作者：
Chunli Tang;Laith Alahmed;Jihao Xu;Maokang Shen;Nicholas Alex Jones;Mehdi Sadi;Ujjwal Guin;W. Zhao;Peng Li
中科院分区：
文献类型：
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作者：
Chunli Tang;Laith Alahmed;Jihao Xu;Maokang Shen;Nicholas Alex Jones;Mehdi Sadi;Ujjwal Guin;W. Zhao;Peng Li
我们设计了一种skyymdilogic （skyymdilogic）栅极，并将其作为模型系统来研究其几何效应和热效应。我们特别关注温度和结构缺陷的影响。利用微磁模拟技术研究了粒子的运动特性，并对粒子的运动特性进行了表征。我们还建立了等效电路模型来计算不同温度下的能量消耗和逻辑运算。我们发现温度显著地影响了粒子的稳定性。在高温下，skyrmion的传播对结构缺陷的钉住效应更强。我们的研究结果强调了热缺陷和结构缺陷的影响，这在以前的逻辑门设计中仍然很大程度上未被探索。
We design a skyrmion-magnetic domain interconversion logic gate (SkyMDILogic) gate and use it as a model system to study the geometrical and thermal effects. We particularly focus on the effects of temperature and structural defects. Micromagnetic simulations are used to study the skyrmion movement and characterize the relevant properties. We also construct an equivalent circuit model to calculate the energy consumption and logic operations at different temperatures. We find that temperature significantly affects the stability of a skyrmion. At elevated temperatures, the skyrmion propagation is more robust against the pinning effect of structural defects. Our results highlight the effects of thermal and structural defects, which remained largely unexplored in previous logic gate designs.