Finite element stress analysis of three filling techniques for class V light-cured composite restorations.
Finite element stress analysis of three filling techniques for class V light-cured composite restorations.
复制标题
V 类光固化复合修复体三种填充技术的有限元应力分析。
DOI：
10.1177/00220345960750070701
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发表时间：
1996
影响因子：
7.6
通讯作者：
Paydar,NH
中科院分区：
文献类型：
--
作者：
Winkler,MM;Katona,TR;Paydar,NH
目前牙科树脂复合材料的一个重要缺点是聚合收缩。这种收缩具有临床影响，例如敏感性、边缘变色和继发性龋齿。本研究的目的是比较三种充填技术在聚合过程中在树脂复合材料/牙齿界面处引起的瞬时应力。技术包括：整体填充（B）、三个水平增量（HI）和三个楔形增量（WI）。在有限元分析中对简单的V类空腔制备进行了建模。通过热应力模拟来模拟聚合收缩，从而由于任意的热膨胀系数而导致1%的收缩。界面法向应力和剪切应力计算在聚合过程中的九个步骤，进行从0%到100%体积的固化树脂。界面瞬态应力的重要性被揭示的发现，在大多数情况下，其峰值超过最终或残余应力。此外，WI和B技术始终分别表现出最高和最低的最大瞬态应力。这些结果从一个简单的模型的V类修复体表明，散装填充的光固化树脂复合材料应使用的牙本质是足够浅，固化到他们的全部深度。
An important disadvantage of current dental resin composites is polymerization shrinkage. This shrinkage has clinical repercussions such as sensitivity, marginal discoloration, and secondary caries. The objective of this study was to compare three filling techniques in terms of the transient stresses induced at the resin composite/tooth interface during polymerization. The techniques were: bulk filling (B), three horizontal increments (HI), and three wedge increments (WI). A simple Class V cavity preparation was modeled in finite element analysis. Polymerization shrinkage was simulated by a thermal stress analogy, thereby causing 1% shrinkage due to an arbitrary coefficient of thermal expansion. Interface normal and shear stresses were calculated at nine steps during polymerization, proceeding from 0% to 100% volume of cured resin. The importance of the interface transient stresses was revealed by the finding that, in most cases, their peak values exceeded the final or residual stress. Also, the WI and B techniques consistently exhibited the highest and lowest maximum transient stresses, respectively. These results from the simple model of a Class V restoration suggest that bulk filling of light-cured resin composites should be used in restorations which are sufficiently shallow to be cured to their full depth.