Seed layer effect on texture and magnetic properties of SmCo5 thin films
Seed layer effect on texture and magnetic properties of SmCo5 thin films
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DOI：
10.1063/1.3068623
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发表时间：
2009-03
影响因子：
3.2
通讯作者：
Lifa Zhang;J. Hu;Jingsheng Chen;J. Ding
中科院分区：
文献类型：
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作者：
Lifa Zhang;J. Hu;Jingsheng Chen;J. Ding
本文研究了种子层对Cu下层微观结构的影响，以及种子层对SmCo5薄膜结构和磁性能的影响。我们主要研究了Ta种子层的厚度效应。我们的研究表明，光滑的Ta种子层可以导致高度织构和良好结晶的（111）Cu下层。在4 nm （Ta厚度）处，Cu（111）衍射峰摇摆曲线（Δθ50）的半最大值全宽度仅为3.3°，Cu表面的表面均方根粗糙度（Rq）仅为0.53 nm。在光滑且高度（111）织构的Cu衬底下，可以清晰地观察到上层结构SmCo5 （000l）峰。此外，SmCo5良好的织构使其具有较高的垂直矫顽力，约为20koe，且具有较大的垂直各向异性。
In this work, we have studied the influence of seed layer on the microstructure of the Cu underlayer and its effect on the structure and magnetic properties of subsequently deposited SmCo5 films. Our investigation concentrated on the thickness effect of Ta seed layer. Our study has shown that a smooth Ta seed layer can lead in a highly textured and well crystallized (111) Cu underlayer. At 4 nm (Ta thickness), the full width at half maximum of the rocking curve (Δθ50) of Cu (111) diffraction peak is only 3.3° and the surface root-mean-square roughness (Rq) of Cu surface is only 0.53 nm. With the smooth and highly (111) textured Cu underlayer, the superstructure SmCo5 (000l) peaks are clearly observed. Also, the good texture of SmCo5 results in a high perpendicular coercivity around 20 kOe with a large perpendicular anisotropy.