Design for reliability of power electronics modules
Design for reliability of power electronics modules
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DOI：
10.1016/j.microrel.2009.07.055
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发表时间：
2009-09-01
影响因子：
1.6
通讯作者：
Yin, Chunyan
中科院分区：
文献类型：
--
作者：
Lu, Hua;Bailey, Chris;Yin, Chunyan
电力电子技术使用半导体技术来转换和控制电力。对高效能源管理、转换和节约的需求，以及交通系统中电子产品使用量的不断增加，导致绝缘栅双极晶体管 (IGBT) 等电力电子设备的使用大幅增长。电力电子器件的封装在可靠性方面给设计工程师带来了许多挑战。例如，IGBT 模块将在较小的占地面积内包含许多半导体芯片，通过铝线和大面积焊点粘合到基板上。在很大程度上，封装的可靠性将取决于这些材料的热机械行为。本文详细介绍了 IGBT 模块可靠性预测的失效物理方法。它还说明了对可靠性预测的概率方法的需求，其中包括设计变化的影响。还讨论了使用预测方法预测封装在承受鉴定应力或使用应力时的剩余寿命的技术。 (C) 2009 年，爱思唯尔有限公司出版。
Power electronics uses semiconductor technology to convert and control electrical power. Demands for efficient energy management, conversion and conservation, and the increasing take-up of electronics in transport systems has resulted in tremendous growth in the use of power electronics devices such as Insulated Gate Bipolar Transistors (IGBT's). The packaging of power electronics devices involves a number of challenges for the design engineer in terms of reliability. For example, IGBT modules will contain a number of semiconductor dies within a small footprint bonded to substrates with aluminum wires and wide area solder joints. To a great extent, the reliability of the package will depend on the thermo-mechanical behavior of these materials. This paper details a physics of failure approach to reliability predictions of IGBT modules. It also illustrates the need for a probabilistic approach to reliability predictions that include the effects of design variations. Also discussed are technologies for predicting the remaining life of the package when subjected to qualification stresses or in service stresses using prognostics methods. (C) 2009 Published by Elsevier Ltd.