Improving performance of cryogenic power electronics
Improving performance of cryogenic power electronics
复制标题
提高低温电力电子器件的性能
DOI：
--
复制
发表时间：
2005
影响因子：
1.8
通讯作者：
E. Mueller
中科院分区：
文献类型：
--
作者：
Pradeep Haldar;Hua Ye;Harry Efstathiadis;James Raynolds;Mike J. Hennessy;O. Mueller;E. Mueller
低温电力电子（CPE）为功率调节系统提供了有前途的好处，与室温对应物相比，在减小尺寸和重量（增加功率密度），提高效率，提高开关速度和提高可靠性方面。诸如半导体开关之类的有源器件可以表现出性能改进，诸如降低的传导损耗、更高的开关速度、降低的二极管反向恢复、更大的器件增益、更高的过流能力以及增加的功率电平。无源器件（电感器、电容器、互连）也将通过降低其组成金属导体的电阻或使用超导体来改进。本文旨在回顾CPE的现状，并提供一个新兴的设备技术，越来越感兴趣的前景。先进的电力电子封装/互连方法，以及适应低温和帮助进一步提高系统的性能进行了讨论。给定改进的和已知的器件和互连特性，系统设计者可以开发最佳电路拓扑以获得最大CPE系统性能。
Cryogenic Power Electronics (CPE) provides promising benefits for power conditioning system compared to their room-temperature counterparts in terms of reduced size and weight (increased power density), improved efficiency, improved switching speed, and improved reliability. Active devices such as semiconductor switches can exhibit performance improvements such as reduced conduction losses, higher switching speed, reduced diode reverse recovery, greater device gain, higher over-current capability, and increased power levels. Passive devices (inductors, capacitors, interconnects) will also improve by the lowered resistance of their constituent metal conductors or the use of superconductors. This paper aims to review the present status of CPE and to provide an outlook on emerging device technologies that are gaining in interest. Advanced power electronic packaging/interconnect methods that adapt well to cryogenics and help further improve system performance is discussed. Given improved and known device and interconnect properties, the system designer can develop the best circuit topologies for maximum CPE system performance.