Effects of Cobalt Addition and Temperature on Microstructure and Density of W-25Cu Composites Prepared via Liquid Infiltration
Effects of Cobalt Addition and Temperature on Microstructure and Density of W-25Cu Composites Prepared via Liquid Infiltration
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DOI：
10.4028/www.scientific.net/amr.626.430
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发表时间：
2012-12
期刊：
影响因子：
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通讯作者：
Ibrahim Hafed;A. Azizan;R. Azmi
中科院分区：
文献类型：
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作者：
Ibrahim Hafed;A. Azizan;R. Azmi
研究了Co含量和烧结温度对熔渗法制备的W-25 Cu复合材料显微组织的影响。所使用的Co添加物的浓度范围为0.5至3 wt. %.浸渗温度在1150°C和1250°C下在真空下进行2小时。讨论了W-25 Cu复合材料的显微组织和烧结密度。结果表明，W-25 wt.添加低浓度的Co和烧结温度对Cu含量影响较大。浓度为3 wt. %的Co和1250°C的浸渗温度得到98.6%理论密度（TD）的高烧结密度。Co含量和浸渗温度对钨铜复合材料的致密化有很大影响。采用扫描电镜结合能谱分析和阿基米德法分别对烧结体的微观结构和致密度进行了研究。
In this study, the effect of Co and sintering temperature on microstructure of W-25Cu composites prepared via copper melt infiltration has been investigated. The concentration of Co addition used ranged from 0.5 to 3wt. %. The infiltration temperatures were performed at 1150°C and 1250°C for 2 hr under vacuum. The microstructure and sintering density of W-25Cu composites are discussed. Results indicated that, the relative density (RD) and microstructure of W-25wt. % Cu were greatly affected by the addition of low Co concentration and sintering temperature. The concentration of 3 wt. % Co to tungsten-copper compact and infiltration temperature of 1250°C give high sintering density of 98.6% theoretical density (TD). The concentration of Co and infiltrating temperature have strong effects on the densification of W-Cu composite materials. The sintered compact microstructures and density were obtained using scanning electron microscope (SEM) coupled with EDX and Archimedes technique respectively.