Interfacial reaction between Sn-Ag solder and electroless Ni-Fe-P diffusion barriers with different internal microstructure
Interfacial reaction between Sn-Ag solder and electroless Ni-Fe-P diffusion barriers with different internal microstructure
复制标题
Sn-Ag焊料与不同内部微观结构的化学镀Ni-Fe-P扩散阻挡层之间的界面反应
DOI：
10.1016/j.materresbull.2022.111854
复制
发表时间：
2022-08-01
影响因子：
5.4
通讯作者：
Chen, Zhiwen
中科院分区：
文献类型：
--
作者：
Liu, Li;Shi, Lin;Chen, Zhiwen
电子器件工作温度的升高显着加速了 Sn-Ag 焊料/Cu 基板界面处 Cu-Sn 金属间化合物 (IMC) 的生长，从而降低了器件的可靠性。因此需要强大的扩散屏障来抑制焊料和基材之间的界面反应。在这项工作中，制备了具有三种不同内部微观结构的化学镀 Ni-Fe-P 涂层，以比较它们在 Sn-Ag 焊料互连中的界面反应和扩散阻挡性能。 Ni-Fe-P涂层可以有效抑制回流焊过程中Sn-Ag焊料互连中界面IMC的过度生长。研究发现，具有晶体结构的Ni-Fe-P涂层对Sn-Ag/Ni-Fe-P界面IMCs的形成和形貌有很大影响。在三种类型的Ni-Fe-P涂层中，结晶Ni-Fe-P由于界面处存在均匀且最薄的FeSn2层而表现出最佳的扩散阻挡性能，而非晶态Ni-Fe-P涂层由于界面处形成不规则且最厚的Ni3Sn4 IMC而表现较差。
The increasing operation temperature of electronic devices significantly accelerates the growth of Cu-Sn inter-metallic compounds (IMCs) at the interfaces of Sn-Ag solder/Cu substrate which deteriorates the device reli-ability. A robust diffusion barrier is thus required to suppress the interfacial reactions between solders and substrates. In this work, electroless Ni-Fe-P coatings with three different internal microstructure were prepared to compare their interfacial reactions and diffusion barrier properties in Sn-Ag solder interconnects. Ni-Fe-P coatings can effectively suppress the excessive growth of interfacial IMCs in Sn-Ag solder interconnects during reflow process. It has been found that the Ni-Fe-P coatings with crystalline structure had great influence on IMCs formation and morphology at Sn-Ag/Ni-Fe-P interfaces. Among three types of Ni-Fe-P coatings, the crystalline Ni-Fe-P exhibited the optimal diffusion barrier property owing to the presence of a uniform and thinnest FeSn2 layer at the interface, while the amorphous Ni-Fe-P coating was less effective due to the irregular and thickest Ni3Sn4 IMCs formed at the interface.