Curing of resole-type phenol–formaldehyde resin
Curing of resole-type phenol–formaldehyde resin
复制标题
甲阶型酚醛树脂的固化
DOI：
10.1002/app.1967.070110106
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发表时间：
1967
影响因子：
3
通讯作者：
Z. Katović
中科院分区：
文献类型：
--
作者：
Z. Katović
采用差热分析和红外光谱对树脂型酚醛树脂的合成工艺进行了研究。结果表明，在中性介质中，首先发生的反应是树脂中存在的游离酚与苯环上具有自由反应位置的单取代羟甲基苯酚之间的反应。亚甲基键的形成之后，马上就是羟甲基的缩合，得到二苄基醚键。随后，这些材料在约210°C的温度下被销毁。人们认为，整个固化过程是由自由基机制控制的。研究还表明，在室温和潮湿条件下，树脂的氧化反应缓慢。
The process of resole-type phenol–formaldehyde resins was studied by differential thermal analysis and infrared spectroscopy. It was shown that in neutral media the first reactions that occur are those between free phenol present in the resin and monosubstituted methylol phenol with free reactive positions on the benzene ring. The formation of methylene linkages is followed immediately by the condensation of methylol groups to give dibenzyl ether linkages. These are subsequently destroyed at about 210°C. It is believed that the entire curing process is governed by a free-radical mechanism. It is also shown that oxidation of the resin occurs slowly at room temperature and humidity.