Surface modified and gradation-mixed Al2O3 as an effective filler for the polyphenylene oxide (PPO) insulative layer in copper clad laminates
Surface modified and gradation-mixed Al2O3 as an effective filler for the polyphenylene oxide (PPO) insulative layer in copper clad laminates
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DOI：
10.1007/s10854-020-04673-0
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发表时间：
2020-10
期刊：
影响因子：
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通讯作者：
Weiwei Zhang;Chen Lu;Mengni Ge;Fan Bu;Jianfeng Zhang
中科院分区：
文献类型：
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作者：
Weiwei Zhang;Chen Lu;Mengni Ge;Fan Bu;Jianfeng Zhang
虽然将陶瓷粉末填充到绝缘聚合物层中长期以来一直被认为是提高覆铜板（CCL）的散热能力和使用寿命的有效策略，但无机填料与有机基体之间的弱界面结合以及不连续的导热网络阻碍了这种有益效果。硅烷偶联剂（KH-560）改性和分级混合的Al 2 O3是一种有效的CCL填料。经过对填充方案的优化，表面改性并梯度填充Al 2 O3的复合材料的最大导热系数达到0.646 W/m·K，明显高于纯树脂复合材料（0.291 W/m·K）和单一尺寸Al 2 O3填充复合材料（Al 2 O3 -20 μm-50%，0.573 W/m·K）。同时，经表面改性和Al 2 O3分级混合后的覆铜板的剥离强度和弯曲强度保持在令人满意的水平（分别为0.903 N/mm和306 MPa），超过了未经改性的覆铜板。介电损耗降低到4.67 × 10- 3，吸水率降低到0.364%。KH-560改善了界面结合，Al 2 O3梯度填充形成了更连续的导热网络，是复合材料综合性能提高的主要原因。这项研究提供了一个新的策略，有希望的高速和高频应用的CCL与这么多的替代陶瓷填料。
Although filling ceramic powders into the insulative polymer layer has long been realized as an effective strategy to elevate the heat dissipation capability and service life of copper clad laminates (CCLs), the weak interfacial bonding between inorganic filler and organic matrix and the discontinuous thermal conductive network have hindered such beneficial effects. Herein, the silane coupling agent (KH-560) modified and gradation mixed Al2O3served as an effective filler for CCLs. After optimization of the filling scheme through tremendous efforts, the maximum thermal conductivity of corresponding CCLs with surface modified and gradation-filled Al2O3achieved to 0.646 W/m·K, apparently higher than that of pure resin CCLs (0.291 W/m·K) and single-size Al2O3filled CCLs (Al2O3-20 μm-50%, 0.573 W/m·K). Simultaneously, the peel strength and bending strength of the CCLs with the surface modified and graded-mixed Al2O3kept at a satisfactory level (0.903 N/mm and 306 MPa, respectively), surpassing those of CCLs with pristine Al2O3fillers. In addition, the dielectric loss reduced to 4.67 × 10–3and the water absorption was as low as 0.364%. Such a comprehensive performance could be ascribed to the improved interfacial bonding brought by KH-560 and a more contiguous heat conduction network formed by the gradation-filled Al2O3. This study offers a new strategy promising for high speed and high frequency applications of CCLs with so many alternative ceramic fillers.