Surface roughness evolutions in sliding wear process

Surface roughness evolutions in sliding wear process
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滑动磨损过程中表面粗糙度的演变

DOI:
10.1016/j.wear.2007.11.002
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发表时间:
2008-07-31
期刊:
影响因子:
5
通讯作者:
Zhou, X. C.
Zhou, X. C.
中科院分区:
工程技术1区
文献类型:
--
作者:
Yuan, C. Q.;Peng, Z.;Zhou, X. C.

文献摘要

被引文献

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磨粒分析是一种用于机器状态监测和故障诊断的技术。影响磨粒分析在机械状态监测中应用的一个关键问题是磨粒的形态是否准确地描述了磨粒的原始状态以及与磨粒分离的部件的表面形貌。本研究旨在探讨滑动磨损过程中磨屑表面形态的演变与磨损成分表面形态变化的关系。滑动磨损试验是使用球盘试验机在适当的润滑和不适当的润滑条件下进行的。研究了磨屑和试件的粒度分布和表面形貌与磨损条件和磨损率的关系。研究了磨屑和磨损成分的表面形貌随磨损过程的演变规律。本研究通过对磨屑的研究,为材料退化的研究提供了新的思路。研究结果表明:(A)磨粒表面形貌与磨损成分的表面形貌有很好的相关性;(B)磨粒表面形态包含了对机械状态监测有价值的信息。(C)2007 Elsevier B.V.保留所有权利。
Wear debris analysis is a technique for machine condition monitoring and fault diagnosis. One key issue that affects the application of wear debris analysis for machine condition monitoring is whether the morphology of the wear particles accurately depicts their original states and the surface morphology of the components from which the particles separate. This study aimed to investigate the evolution of the surface morphology of wear debris in relation to change in the surface morphology of wear components in sliding wear process. Sliding wear tests were conducted using a ball-on-disc tester under proper lubrication and improper lubrication conditions. The study of the particle size distribution and the surfaces of both the wear debris and the tested samples in relation to the wear condition and the wear rates of the wear components were carried out in this study. The evolutions of the surface topographies of both the wear debris and the wear components as wear progressed were investigated. This study has provided insight to the progress of material degradation through the study of wear debris. The results of this research have clearly demonstrated that: (a) there is a good correlation of the surface morphology of wear debris and that of the wear components, and (b) the surface morphology of wear debris contains valuable information for machine condition monitoring. (C) 2007 Elsevier B.V. All rights reserved.