Characterization of Nanoscopic Cu/Diamond Interfaces Prepared by Surface-Activated Bonding: Implications for Thermal Management

Characterization of Nanoscopic Cu/Diamond Interfaces Prepared by Surface-Activated Bonding: Implications for Thermal Management
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DOI：
10.1021/acsanm.9b02558
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发表时间：
2020-02
期刊：
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影响因子：
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通讯作者：
Jianbo Liang;Y. Ohno;Yuichiro Yamashita;Y. Shimizu;Shinji Kanda;N. Kamiuchi;Seong-Woo Kim;Koyama Koji;Y. Nagai;M. Kasu;N. Shigekawa
Jianbo Liang;Y. Ohno;Yuichiro Yamashita;Y. Shimizu;Shinji Kanda;N. Kamiuchi;Seong-Woo Kim;Koyama Koji;Y. Nagai;M. Kasu;N. Shigekawa
中科院分区：
其他
文献类型：
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作者：
Jianbo Liang;Y. Ohno;Yuichiro Yamashita;Y. Shimizu;Shinji Kanda;N. Kamiuchi;Seong-Woo Kim;Koyama Koji;Y. Nagai;M. Kasu;N. Shigekawa

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