Surface Shape and Contact Pressure Evolution in Two Component Surfaces: Application to Copper Chemical Mechanical Polishing
Surface Shape and Contact Pressure Evolution in Two Component Surfaces: Application to Copper Chemical Mechanical Polishing
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两个部件表面的表面形状和接触压力演变：在铜化学机械抛光中的应用
DOI：
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发表时间：
2004
期刊：
影响因子：
--
通讯作者：
W. Sawyer
中科院分区：
文献类型：
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作者：
W. Sawyer
在集成电路技术中，抛光过程中出现的两个缺陷是腐蚀和盘蚀。在这份手稿中，一个通用的数值模型，是能够描述这些缺陷，从力学的角度提出。该数值模型描述了在恒定平均抛光压力下，由两种不同材料组成的具有不同磨损率的初始平面样品表面形状的演变。接触压力计算采用双参数弹性地基模型。从质量上讲，结果与已发表的铜化学机械抛光实验数据相比较有利。虽然完全是机械的，但这种建模可能会提供对抛光过程中遇到的表面缺陷和错误的力学见解。
Two defects that arise from the polishing process in integrated circuits technology are erosion and dishing. In this manuscript a generic numerical model that is capable of describing these defects from a mechanics perspective is presented. This numerical model formulates evolution of surface shape for an initially flat sample made up of two distinct materials with different wear rates under constant average polishing pressure. A two parameter elastic foundation model is used for contact pressure calculations. Qualitatively, the results compare favorably to published experimental data collected for copper chemical mechanical polishing. Although entirely mechanical, such modeling may perhaps provide insight into the mechanics of the surface defects and errors encountered during polishing.
影响因子：
2.4
作者：
Maxian, TA;Brown, TD;Callaghan, JJ
通讯作者：
Callaghan, JJ