The effect of intermediate layer densification on the critical current of a Bi-2223 superconducting joint
The effect of intermediate layer densification on the critical current of a Bi-2223 superconducting joint
复制标题
中间层致密化对Bi-2223超导接头临界电流的影响
DOI：
10.1088/1361-6668/acaccd
复制
发表时间：
2023
影响因子：
3.6
通讯作者：
Kitaguchi H
中科院分区：
文献类型：
--
作者：
Takeda Y;Nishijima G;Inoue K;Takano Y;Kitaguchi H
定量研究了中间层致密化对Bi-2223超导接头临界电流Ic的影响。首先，我们评估的相纯度，密度，和晶界临界电流密度（JC）的Bi-2223厚膜样品模拟的中间层。样品被单轴压制以增加膜密度。经过两次热处理的压制膜，J c的增加实现。其次，我们通过在两个Bi-2223带之间合成中间层来制造超导接头。在接头上施加均匀的单轴压力导致形成均匀的结构。该工艺使得具有高n值的超导接头的可再现制造成为可能。通过中间压制和两次热处理提高了超导接头的Ic。然而，在高压下的压制可机械地损坏Bi-2223带中的细丝，导致Ic的降低。样品表征表明，产生高Ic的最佳IP压力范围为1.5 ~ 2× 108 Pa。我们证实压制使超导接头的中间层致密化。我们的实验结果和分析表明，致密化的中间层提高了Bi-2223超导接头的Ic。
The effect of intermediate layer densification on the critical current (I c) of Bi-2223 superconducting joints was quantitatively studied. First, we evaluated the phase purity, density, and intergrain critical current density (J c) of Bi-2223 thick film samples simulating the intermediate layer. The samples were uniaxially pressed to increase the film density. After two heat treatments of the pressed film, an increase in J c was achieved. Second, we fabricated superconducting joints by synthesizing an intermediate layer between two Bi-2223 tapes. Applying a uniform uniaxial pressure on the joint resulted in the formation of a homogeneous structure. This process enables the reproducible fabrication of superconducting joints with high n values. The I c of the superconducting joint was increased by intermediate pressing (IP) and two heat treatments. However, pressing at high pressures can mechanically damage filaments in the Bi-2223 tapes, leading to a decrease in I c. Sample characterization showed that the optimum IP pressure range to produce high I c was 1.5–2× 10 8 Pa. We confirmed that pressing densified the intermediate layer of the superconducting joints. Our experimental results and analyses reveal that densification of the intermediate layer increases the I c of Bi-2223 superconducting joints.