Three-dimensional printing of soft hydrogel electronics
Three-dimensional printing of soft hydrogel electronics
复制标题
DOI：
10.1038/s41928-022-00887-8
复制
发表时间：
2022-12-19
影响因子：
34.3
通讯作者：
Zhou, Nanjia
中科院分区：
文献类型：
--
作者：
Hui, Yue;Yao, Yuan;Zhou, Nanjia
Electronics based on hydrogels can have inherent similarities to biological tissue and are of potential use in biomedical applications. Ideally, such hydrogel electronics should offer customizable three-dimensional circuits, but making complex three-dimensional circuits encapsulated within a hydrogel matrix is challenging with existing materials and manufacturing methods. Here we report the three-dimensional printing of hydrogel electronics using a curable hydrogel-based supporting matrix and a stretchable silver-hydrogel ink. The supporting matrix has a yield stress fluid behaviour, so the shear force generated by a moving printer nozzle creates a temporary fluid-like state, allowing the accurate placement in the matrix of silver-hydrogel ink circuits and electronic components. After printing, the entire matrix and embedded circuitry can be cured at 60 degrees C to form soft (Young's modulus of less than 5 kPa) and stretchable (elongation of around 18) monolithic hydrogel electronics, whereas the conductive ink exhibits a high conductivity of around 1.4 x 10(3) S cm(-1). We use our three-dimensional printing approach to create strain sensors, inductors and biological electrodes.
