Could thermal stresses in a BGA/CGA-system be evaluated from a model intended for a homogeneously bonded assembly?
Could thermal stresses in a BGA/CGA-system be evaluated from a model intended for a homogeneously bonded assembly?
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DOI：
10.1007/s10854-015-3790-9
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发表时间：
2015
期刊：
影响因子：
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通讯作者：
E. Suhir;R. Ghaffarian;J. Nicolics
中科院分区：
文献类型：
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作者：
E. Suhir;R. Ghaffarian;J. Nicolics
建立了一个分析球栅阵列（BGA）或列栅阵列（CGA）型非均匀键合组件热应力的应力模型。它表明，一个人可以摆脱采用一个简单的模型，旨在为一个组件与一个均匀的债券，如果之间的差距支持（BGA球或CGA柱）很小，因此间距比（接头中心之间的距离）与接头宽度21s之间的距离小于5，界面剪应力参数k与等效均匀粘接组件中组件长度的一半的乘积k1大于2.5.实际BGA和CGA系统的情况确实如此。这一发现也可用于其他工程领域，例如机械或结构领域，当有意通过使用连续弹性基础上的梁模型替换单独支撑上的梁模型来简化计算时。
An analytical stress model is developed for the evaluation of thermal stresses in an inhomogeneously bonded assembly of the ball-grid-array (BGA) or column grid array (CGA) type. It is shown that one can get away with employing a simpler model intended for an assembly with a homogeneous bond, if the gaps between the supports (BGA balls or CGA columns) are small, so that the ratioof the pitchp(the distance between the joint centers) to the joint widths 2lis below 5, and the productklof the parameterkof the interfacial shearing stress and half the assembly lengthlin the equivalent homogeneously bonded assembly is above 2.5. This is indeed the case for actual BGA and CGA systems. This finding can be used also in other areas of engineering, such as, say, mechanical or structural, when there is an intent to simplify the calculations by replacing a model for beams on separate supports by using a model intended for a beam on a continuous elastic foundation.