Vibration response of printed circuit board in wide range of temperature. Characterization of PCB materials

Vibration response of printed circuit board in wide range of temperature. Characterization of PCB materials
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印刷电路板在宽温度范围内的振动响应。

DOI:
10.1109/isse.2009.5207026
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发表时间:
2009
期刊:
2009 32nd International Spring Seminar on Electronics Technology
影响因子:
--
通讯作者:
J. Felba
J. Felba
中科院分区:
--
文献类型:
--
作者:
P. Matkowski;R. Zawierta;J. Felba

文献摘要

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相似文献

印刷电路板(PCB)的刚度对焊点的可靠性有很大影响。振动或外部应力加载导致焊点区域内应力积累。根据强度的不同,诱导应力可以通过焊点的蠕变或断裂来缓解。感应应力的强度取决于加载条件以及连接材料的特性(特别是印刷电路板的刚度)。关键参数如刚度和Tg取决于层压板的生产商。因此,PCB材料的准确评价是提高设备可靠性的基础。如今,从亚洲进口的FR4层压板的生产商数量和质量都在迅速增加,掌握所用材料的完整参数就显得尤为重要。专门设计的台架将用于确定印刷电路板的振动响应。实施的新颖解决方案将确保测量的高精度。所提出的振动响应表征方法比基于扫描激光测振仪的标准方法成本更低。该支架将用于确定FR4刚度在宽温度范围内的变化(例如从- 20°C到130°C)和Tg参数。在本文的框架内,描述了测量站和已进行的评估结果
Stiffness of printed circuit boards (PCB) has a great impact on reliability of solder joints. Vibrations or external stress loading lead to stress accumulation within solder joint area. Depending on intensity, inducted stress can be relieved by creep or fractures of solder joint. Intensity of inducted stress depends on loading conditions as well as properties of joined materials (specially stiffness of printed circuit boards).Crucial parameters such as stiffness and Tg depends on the producer of laminate. Therefore accurate evaluation of PCB material is a basis for improvement of equipment reliability. Nowadays, when the number of producers and the mass of FR4 laminate imported from Asia is rapidly increasing, it is specially important to have the complete knowledge about parameters of used materials. Dedicated, designed stand will be applied to determine vibration response of printed circuit boards. The novel solutions implemented will ensure high accuracy of measurements. Proposed method for vibration response characterization will be cheaper to standard method that bases on scanning laser vibrometer. The stand will be used to determine changes of FR4 stiffness in wide range of temperature (for example from − 20 to 130 °C) and Tg parameter. Within the frame of the paper, measuring stand and the results of performed evaluations are described