Debonding dynamics of pressure-sensitive adhesives: 3D block model
Debonding dynamics of pressure-sensitive adhesives: 3D block model
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DOI：
10.1140/epje/i2006-10073-5
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发表时间：
2006-12-01
影响因子：
1.8
通讯作者：
Doi, M.
中科院分区：
文献类型：
--
作者：
Yamaguchi, T.;Doi, M.
我们建立了一个三维力学模型，该模型描述了在探针-粘性试验的剥离阶段，粘弹性固体介质中的空腔膨胀。典型压敏胶粘剂的应力-应变曲线与实验结果吻合较好。我们还表明，分离速度的依赖性可以用空洞周围大应变率引起的粘性耗散来解释。
We develop a 3-dimensional mechanical model which describes cavity expansions in a viscoelastic solid medium during the debonding phase of the probe-tack test. The stress-strain curves are in good agreement with experiments for the typical pressure-sensitive adhesives. We also show that the separation speed dependence can be explained by viscous dissipations due to large strain rates around the cavities.