Electrically Conductive Liquid Metal Composite Adhesives for Reversible Bonding of Soft Electronics
Electrically Conductive Liquid Metal Composite Adhesives for Reversible Bonding of Soft Electronics
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DOI：
10.1002/adfm.202304101
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发表时间：
2023-07
影响因子：
19
通讯作者：
A B M Tahidul Haque;D. Ho;Dohgyu Hwang;Ravi Tutika;Chanhong Lee;Michael D. Bartlett
中科院分区：
文献类型：
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作者：
A B M Tahidul Haque;D. Ho;Dohgyu Hwang;Ravi Tutika;Chanhong Lee;Michael D. Bartlett
集成不同材料组件以创建软电子和机器人系统需要导电粘合剂。在这里，开发了一种异质液态金属基导电粘合剂，它可可逆地附着到具有高拉伸性（> 100％应变）、低模量（< 100 kPa）和应变不变导电性的不同表面。这种带有粘性液态金属 (STICK-LM) 粘合剂的软集成复合材料由异质渐变薄膜组成，该薄膜具有富含液态金属的一面，在指定位置压花以实现导电性，以及用于集成的电绝缘粘合剂面。粘合行为经过调整，粘合能量 > 70 Jm−2（≈ 比未改性复合材料增强 25 倍），并通过粘弹性分析进行描述，为导电系统中可控但可逆的粘合提供设计指南。 STICK-LM 粘合剂的结构提供各向异性和异质导电性，并能够直接集成到软功能系统中。机器人关节的可变形保险丝、快速附着在曲线表面上的可重新定位电子器件以及具有几乎恒定电阻的可拉伸粘合导体都证明了这一点。这项研究为新兴技术中多组分系统的电气和机械集成提供了一种导电、可逆粘合剂的方法。
Conductive adhesives are required for the integration of dissimilar material components to create soft electronic and robotic systems. Here, a heterogeneous liquid metal‐based conductive adhesive is developed that reversibly attaches to diverse surfaces with high stretchability (>100% strain), low modulus (<100 kPa), and strain‐invariant electrical conductivity. This SofT integrated composite with tacK through liquid metal (STICK‐LM) adhesive consists of a heterogeneous graded film with a liquid metal‐rich side that is embossed at prescribed locations for electrical conductivity and an electrically insulating adhesive side for integration. Adhesion behavior is tuned for adhesion energies > 70 Jm−2(≈ 25x enhancement over unmodified composites) and described with a viscoelastic analysis, providing design guidelines for controllable yet reversible adhesion in electrically conductive systems. The architecture of STICK‐LM adhesives provides anisotropic and heterogeneous electrical conductivity and enables direct integration into soft functional systems. This is demonstrated with deformable fuses for robotic joints, repositionable electronics that rapidly attach on curvilinear surfaces, and stretchable adhesive conductors with nearly constant electrical resistance. This study provides a methodology for electrically conductive, reversible adhesives for electrical and mechanical integration of multicomponent systems in emerging technologies.