Effect of the microstructure of copper oxide on the adhesion behavior of epoxy/copper leadframe joints
Effect of the microstructure of copper oxide on the adhesion behavior of epoxy/copper leadframe joints
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DOI：
10.1163/156856100742230
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发表时间：
2000-01-01
影响因子：
2.3
通讯作者：
Cho, EC
中科院分区：
文献类型：
--
作者：
Cho, KW;Cho, EC
在175 ℃下对铜引线框架进行热氧化，通过研究铜氧化物的微观结构随铜热氧化时间的变化，分析了环氧树脂/铜引线框架接头的粘附行为。剥离强度在氧化的早期阶段（类似于20分钟）急剧增加，随后略有增加。进一步氧化（120分钟）后，剥离强度略有下降。水和二碘甲烷的接触角在氧化的早期急剧下降，之后的变化可以忽略。X射线光电子能谱（XPS）结果表明，随着氧化时间的增加，氧化铜的化学组成发生了变化（Cu/Cu 2 O--> Cu 2 O--> CuO），这种变化改善了铜表面的润湿性，从而影响剥离强度。通过扫描电子显微镜（SEM）和原子力显微镜（AFM）研究的氧化铜的表面粗糙度的增加导致环氧树脂和氧化铜进行机械互锁，这增加了剥离强度。SEM和XPS分析表明，氧化层的破坏主要发生在氧化铜层上，且随着氧化时间的延长，氧化铜层的数量逐渐增加，这是由于氧化层的机械强度较弱。然而，一小部分的环氧树脂在失效过程中也断裂，与氧化时间无关。因此，断裂主要发生在靠近环氧树脂/氧化铜界面的氧化铜中。
The thermal oxidation of copper leadframe was carried out at 175 degreesC and the adhesion behavior of the epoxy/copper leadframe joint was analyzed by investigating the microstructure changes of copper oxide with the thermal oxidation time of copper. The peel strength increased sharply at an early stage of oxidation (similar to 20 min) followed by a slight increase. After further oxidation (120 min), the peel strength showed a slight decrease. The contact angles of water and diiodomethane decreased sharply at an early stage of oxidation with negligible change afterwards. As the oxidation time increased, X-ray photoelectron spectroscopy (XPS) results revealed that the chemical composition of copper oxide had changed (Cu/Cu2O --> Cu2O --> CuO); this change improved the wettability of the copper surface, which affected the peel strength. Increase of the surface roughness of copper oxide, investigated by scanning electron microscopy (SEM) and atomic force microscopy (AFM), causes the epoxy resin and copper oxide to undergo mechanical interlocking, which increases the peel strength. Failure analysis by SEM and XPS indicated that failure was largely in the copper oxide, and the amount of copper oxide on the peeled epoxy increased as the oxidation time increased, due to the weak mechanical strength of the oxide layer. However, a small portion of the epoxy resin was also fractured during the failure process, regardless of the oxidation time. Consequently, fracture proceeded mainly in the copper oxide close to the epoxy resin/copper oxide interface.