Electrical properties of inalp native oxides for metal-oxide-semiconductor device applications

Electrical properties of inalp native oxides for metal-oxide-semiconductor device applications
复制标题

用于金属氧化物半导体器件应用的 inalp 天然氧化物的电性能

DOI:
10.1063/1.1861981
复制
发表时间:
2004
影响因子:
5.1
通讯作者:
Z. Liliental
Z. Liliental
中科院分区:
生物学2区
文献类型:
--
作者:
Yu Cao;J. Zhang;Xiang Li;T. Kosel;P. Fay;D. Hall;Xiaohong Zhang;R. Dupuis;J. Jasinski;Z. Liliental

文献摘要

被引文献

相似文献

数据显示了金属氧化物半导体 (MOS) 器件厚度(约 100 nm 以下)天然氧化物的绝缘特性和电容电压 (CV) 特性,这些天然氧化物是通过与 GaAs 晶格匹配的薄 InAlP 外延层的湿热氧化形成的。对于用 17 nm 和 48 nm 氧化物制造的 MOS 电容器,在 1 MV/cm 的施加场下分别观察到 J=1.4 x 10-9 A/cm2 和 J=8.7 x 10-11 A/cm2 的低漏电流密度。 TEM图像显示,110 nm氧化物中存在的富In界面颗粒在17 nm氧化物薄膜中不存在。在 n 型和 p 型 GaAs 上制造的 MOS 电容器的准静态电容-电压测量表明,InAlP 氧化物-GaAs 界面完全没有陷阱以支持反转,表明未钉扎的费米能级。这些数据表明 InAlP 原生氧化物可能是 GaAs MOS 器件应用的可行绝缘体。
Data are presented on the insulating properties and capacitance-voltage (CV) characteristics of metal-oxide-semiconductor (MOS) device-thickness (below approx. 100 nm) native oxides formed by wet thermal oxidation of thin InAlP epilayers lattice matched to GaAs. Low leakage current densities of J=1.4 x 10-9 A/cm2 and J=8.7 x 10-11 A/cm2 are observed at an applied field of 1 MV/cm for MOS capacitors fabricated with 17 nm and 48 nm oxides, respectively. TEM images show that the In-rich interfacial particles which exist in 110 nm oxides are absent in 17 nm oxide films. Quasi-static capacitance-voltage measurements of MOS capacitors fabricated on both n-type and p-type GaAs show that the InAlP oxide-GaAs interface is sufficiently free of traps to support inversion, indicating an unpinned Fermi level. These data suggest that InAlP native oxides may be a viable insulator for GaAs MOS device applications.