Light based synthesis of metallic nanoparticles on surface-modified 3D printed substrates for high performance electronic systems
Light based synthesis of metallic nanoparticles on surface-modified 3D printed substrates for high performance electronic systems
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DOI：
10.1016/j.addma.2020.101367
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发表时间：
2020-08-01
影响因子：
11
通讯作者：
Kay, Robert W.
中科院分区：
文献类型：
--
作者：
Esfahani, Reza N.;Shuttleworth, Matthew P.;Kay, Robert W.
加法制造能够生产高度复杂和个性化的产品。然而，要实现现代大规模生产的电子系统的性能、可靠性和小型化，需要在材料科学和工艺方面进行创新。本文提出了一种新的数字化制造策略，它将高性能聚合物(聚醚酰亚胺)的3D打印与基于光的选择性金属化铜痕迹相结合，通过对聚合物表面进行化学修饰，并通过计算机控制功能器件和结构的组装。使用这种方法，可以在柔性和共形表面上制造精确而坚固的导电电路，而不需要连接和组装单独的电路。为了显示该工艺如何与现有的电子封装技术兼容，一系列现代元件被焊料表面贴装组装到选择性金属化的焊盘上。为了突出这一新能力带来的潜在应用，制造了高频无线通信、感应供电和位置传感演示器，并对其进行了表征。此外，通过形状记忆合金的选择性加热来实现致动，以期朝着可折叠和可展开的3D电子系统的方向发展。本文中的结果显示了该工艺如何为未来在机器人、医学和可穿戴技术领域的真实世界应用提供所需的机械、电、热和电磁特性。
Additive Manufacturing is capable of producing highly complex and personalised products. However, innovation in both material science and processing is required to achieve the performance, reliability and miniaturization of modern mass-produced electronic systems. This article presents a new digital fabrication strategy that combines 3D printing of high-performance polymers (polyetherimide) with light-based selective metallisation of copper traces through chemical modification of the polymer surface, and computer-controlled assembly of functional devices and structures. Using this approach, precise and robust conductive circuitry is fabricated across flexible and conformal surfaces omitting the need to connect and assemble separate circuits. To show how this process is compatible with existing electronic packaging techniques a range of modern components are solder surface mount assembled to selectively metalized bond pads. To highlight the potential applications stemming from this new capability, high frequency wireless communications, inductive powering and positional sensing demonstrators are manufactured and characterised. Furthermore, the incorporation of actuation is achieved through selective heating of shape memory alloys with a view towards routes towards folding and deployable 3D electronic systems. The results in this paper show how this process provides the required mechanical, electrical, thermal and electromagnetic properties for future real-world applications in the field of robotics, medicine, and wearable technologies.