CMOS integrated tactile sensor array by porous Si bulk micromachining
CMOS integrated tactile sensor array by porous Si bulk micromachining
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DOI：
10.1016/j.sna.2007.08.003
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发表时间：
2008-03-10
影响因子：
4.6
通讯作者：
Barsony, Istvan
中科院分区：
文献类型：
--
作者：
Adam, Maria;Mohacsy, Tibor;Barsony, Istvan
开发了一种用于触觉传感的集成式8×8元件三维力传感器阵列。300×300μm²的传感器由间距为700μm的单晶硅膜制成。各个传感器的信号通过片上CMOS解码器逐行读出。多孔硅体微加工是n阱CMOS兼容工艺的最后步骤之一。©2007爱思唯尔有限公司。保留所有权利。
An integrated 8 x 8 element 3D force sensor array was developed for tactile sensing. The 300 x 300 mu m(2) sensors are formed from monocrystalline silicon membranes with spacing of 700 mu m. The signals of the individual transducers are read out line-by-line via an on-chip CMOS decoder. The porous silicon bulk micromachining was implemented as one of the final steps of the n-well CMOS compatible processing. (C) 2007 Elsevier B.V. All rights reserved.