Superior High‐Temperature Energy Density in Molecular Semiconductor/Polymer All‐Organic Composites

Superior High‐Temperature Energy Density in Molecular Semiconductor/Polymer All‐Organic Composites
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DOI:
10.1002/adfm.202210050
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发表时间:
2022-11
影响因子:
19
通讯作者:
Bin Zhang;Xiao‐ming Chen;Zhe Pan;Peng Liu;M. Mao;Kaixin Song;Zhu Mao;Rong Sun;Dawei Wang;Shujun Zhang
Bin Zhang;Xiao‐ming Chen;Zhe Pan;Peng Liu;M. Mao;Kaixin Song;Zhu Mao;Rong Sun;Dawei Wang;Shujun Zhang
中科院分区:
材料科学1区
文献类型:
--
作者:
Bin Zhang;Xiao‐ming Chen;Zhe Pan;Peng Liu;M. Mao;Kaixin Song;Zhu Mao;Rong Sun;Dawei Wang;Shujun Zhang

文献摘要

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高温介电聚合物在混合动力汽车、并网光伏和风力发电等多种大功率电子设备中的需求不变。然而,仍然缺乏能够在高温(>150°C)下工作的介电聚合物。本文将n型分子半导体1,4,5,8-萘四甲酸二酸酐(NTCDA)与聚醚酰亚胺(PEI)共混,制备了一系列全有机介电聚合物复合材料。通过在PEI中引入微量的n型小分子半导体NTCDA形成电子陷阱,有效地降低了漏电流,提高了复合材料的高温击穿强度和储能性能。尤其是0.5vol.%NTCDA/PEI在150℃和200℃的高温下具有优异的储能性能,例如150℃下5.1J cm−3和200℃下3.2J cm−3的超高放电能量密度,放电效率为85-90%,优于最先进的同类产品。本研究为设计用于先进电子电气系统的高温介电聚合物提供了一种简便有效的策略。
High‐temperature dielectric polymers are in constant demand for the multitude of high‐power electronic devices employed in hybrid vehicles, grid‐connected photovoltaic and wind power generation, to name a few. There is still a lack, however, of dielectric polymers that can work at high temperature (> 150 °C). Herein, a series of all‐organic dielectric polymer composites have been fabricated by blending the n‐type molecular semiconductor 1,4,5,8‐naphthalenetetracarboxylic dianhydride (NTCDA) with polyetherimide (PEI). Electron traps are created by the introduction of trace amounts of n‐type small molecule semiconductor NTCDA into PEI, which effectively reduces the leakage current and improves the breakdown strength and energy storage properties of the composite at high temperature. Especially, excellent energy storage performance is achieved in 0.5 vol.% NTCDA/PEI at the high temperatures of 150 and 200 °C, e.g., ultrahigh discharge energy density of 5.1 J cm−3 at 150 °C and 3.2 J cm−3 at 200 °C with high discharge efficiency of 85–90%, which is superior to its state‐of‐the‐art counterparts. This study provides a facile and effective strategy for the design of high‐temperature dielectric polymers for advanced electronic and electrical systems.