Recovery of elastic constant of ultrathin Cu films by low temperature annealing
Recovery of elastic constant of ultrathin Cu films by low temperature annealing
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DOI：
10.1063/1.2908039
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发表时间：
2008-04
影响因子：
4
通讯作者：
N. Nakamura;H. Ogi;T. Shagawa;M. Hirao
中科院分区：
文献类型：
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作者：
N. Nakamura;H. Ogi;T. Shagawa;M. Hirao
通过声子共振光谱研究了退火对铜薄膜弹性常数的影响。在真空中沉积后，于不同温度（最高达200°C）下进行30分钟的退火处理。退火处理并未使X射线衍射光谱发生明显变化，但却显著提高了弹性常数。沉积态铜薄膜的弹性常数比块状铜小20%，而在200°C退火后，其弹性常数恢复到了块状铜的数值。
Annealing effect on the elastic constant of Cu thin films was investigated by acoustic-phonon resonance spectroscopy. Annealing treatment was performed after the deposition in vacuum condition for 30min at various temperatures up to 200°C. It did not cause obvious changes in the x-ray diffraction spectra, but it significantly increased the elastic constant. The elastic constant of the as-deposited Cu film was smaller than that of bulk Cu by 20%, and it recovered to the bulk value by the postannealing at 200°C.