Curing behavior, mechanical and thermal properties of epoxy‐CeO 2 nanocomposites
Curing behavior, mechanical and thermal properties of epoxy‐CeO 2 nanocomposites
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DOI：
10.1002/app.51529
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发表时间：
2021-08
影响因子：
3
通讯作者：
Zhijuan Yuan;M. Al Hassan;Zhi‐cheng Wang;Jun‐yi Wang;Jun Wang;M. Derradji;Wen‐bin Liu
中科院分区：
文献类型：
--
作者：
Zhijuan Yuan;M. Al Hassan;Zhi‐cheng Wang;Jun‐yi Wang;Jun Wang;M. Derradji;Wen‐bin Liu
纳米颗粒已广泛用于改善环氧基体的机械和热性能。本研究将由丙烯酸和2,4,6-三甲基间苯二胺组成的室温固化剂与不同浓度的CeO2纳米粒子混合到环氧树脂（E51）中，得到可快速成型和固化的纳米复合材料。采用傅里叶变换红外光谱和差示扫描量热法研究了纳米复合材料和E51与合成固化剂的固化行为。通过拉伸、弯曲和冲击测试，讨论了纳米颗粒含量对所制备复合材料力学和热性能的影响。结果表明，固化过程在4小时内完成。与纯树脂相比，负载 5 wt% CeO2 的固化纳米复合材料的拉伸强度提高了 78.4%，弯曲强度提高了 81.7%，伸长率提高了 122.0%。热重分析结果表明，随着CeO2纳米填料含量的增加，热稳定性增加。最后，扫描电子显微镜揭示了复合材料的断口形貌。
Nanoparticles have been widely used in the improvement of the mechanical and thermal properties of the epoxy matrix. In this study, the room temperature curing agent composed of acrylic acid and 2,4,6‐trimethyl‐m‐phenylenediamine was mixed with different concentrations of CeO2nanoparticles into the epoxy resin (E51) to obtain a nanocomposite that can be rapidly molded and cured. Fourier transform infrared spectroscopy and differential scanning calorimetry were used to study the curing behavior of nanocomposites and E51 with the synthesized hardener. Through tensile, flexural, and impact tests, the influence of the nanoparticles content on the mechanical and thermal properties of the prepared composites was discussed. The results showed that the curing process was completed in 4 h. An increase of 78.4% in tensile strength, 81.7% in flexural strength, and 122.0% in elongation were obtained for the cured nanocomposite having 5 wt% CeO2loading compared to the neat resin. Thermogravimetric analysis result showed that the thermal stability increased with increasing of CeO2nanofillers content. Finally, the scanning electron microscope revealed the fracture surface morphology of the composites.