ANALYSIS OF HEAT FLOW DATA-IN SITU THERMAL CONDUCTIVITY MEASUREMENTS
ANALYSIS OF HEAT FLOW DATA-IN SITU THERMAL CONDUCTIVITY MEASUREMENTS
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DOI：
10.1139/e71-001
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发表时间：
1971
影响因子：
1.4
通讯作者：
A. Beck;F. Anglin;J. Sass
中科院分区：
文献类型：
--
作者：
A. Beck;F. Anglin;J. Sass
The electrically heated cylindrical probe has often been used to measure the thermal conductivity of materials which allow the contact layer to be small enough to have negligible thermal resistance...
