Aggregation dynamics of molecular bonds between compliant materials
Aggregation dynamics of molecular bonds between compliant materials
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顺应性材料之间分子键的聚集动力学
DOI：
10.1039/c4sm02903h
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发表时间：
2015-01-01
期刊：
影响因子：
3.4
通讯作者：
He, Linghui
中科院分区：
文献类型：
--
作者：
Jiang, Hongyuan;Qian, Jin;He, Linghui
在这篇文章中，我们发展了一个机械力化学模型框架，在这个框架中，受体-配体键的时空演化发生在两个柔顺介质之间的界面上，存在外加拉伸载荷。键的移位、解离和缔合同时发生，导致分子键的动态聚集，这种聚集受材料柔度和外加应力等力学因素的调节。结果表明，在从键扩散到反应的复杂时间尺度的非平衡过程中，键的聚集是有利的。材料硬度被预测为有助于黏附增长，并且最佳水平的外加应力导致基于整合素的黏附的键团大小最大化，这与关于细胞-基质相互作用的焦点黏附的相关实验观察一致。键团簇内部的应力分布一般是不均匀的，并且受应力集中指数的控制。
In this paper, we develop a mechanochemical modeling framework in which the spatial-temporal evolution of receptor-ligand bonds takes place at the interface between two compliant media in the presence of an externally applied tensile load. Bond translocation, dissociation and association occur simultaneously, resulting in dynamic aggregation of molecular bonds that is regulated by mechanical factors such as material compliance and applied stress. The results show that bond aggregation is energetically favorable in the out-of-equilibrium process with convoluted time scales from bond diffusion and reaction. Material stiffness is predicted to contribute to adhesion growth and an optimal level of applied stress leads to the maximized size of bond clusters for integrin-based adhesion, consistent with related experimental observations on focal adhesions of cell-matrix interactions. The stress distribution within bond clusters is generally non-uniform and governed by the stress concentration index.