In-situ observation of ultrasonic bonding using high speed camera
In-situ observation of ultrasonic bonding using high speed camera
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DOI：
10.1109/ltb-3d.2014.6886184
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发表时间：
2014-07
期刊：
影响因子：
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通讯作者：
T. Shuto;T. Asano
中科院分区：
文献类型：
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作者：
T. Shuto;T. Asano
利用超声作用下的锥形金凸点，实现了空气环境下的室温微连接。利用高速摄像机对超声键合过程进行了现场观察，以研究键合过程的动力学。在超声波作用下观察到凸起的“软化”现象。建议在100ms内基本完成键合。
Room-temperature microjoining in the air ambient has been achieved by using cone-shaped Au bump with ultrasonic application. In-situ observation of the ultrasonic bonding is performed using a high speed camera for the purpose of investigating dynamics of the bonding process. “Softening” of the bump under the application of ultrasonic is observed. It is suggested that bonding is almost completed within 100 ms.