Electrical Insulation Design and Accurate Estimation of Temperature via an Electrothermal Model for a 10 kV SiC Power Module Packaging
Electrical Insulation Design and Accurate Estimation of Temperature via an Electrothermal Model for a 10 kV SiC Power Module Packaging
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DOI：
10.1109/ceidp49254.2020.9437513
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发表时间：
2020-10
期刊：
影响因子：
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通讯作者：
M. Tousi;M. Ghassemi
中科院分区：
文献类型：
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作者：
M. Tousi;M. Ghassemi
宽带隙（WBG）功率器件可以承受比硅（Si）基功率器件更高的电流和电压。然而，实现其上级特性与其封装的可靠性密切相关，其中热管理和可靠的电绝缘设计是最具挑战性的任务。如果不注意前一个因素，会导致热失控，而后一个因素则会导致整个模块的电击穿。在本文中，一个10-kV的SiC二极管的封装设计进行了研究，解决上述两个挑战。电气绝缘设计通过COMSOL Multiphysics开发的有限元法（FEM）电场计算模型进行，满足基于IEC 61287-1的一分钟绝缘和局部放电测试。通过开发一个热电偶模型，并考虑尺寸，结温的准确估计，以确定模块的最大负载电流。
Wide-bandgap (WBG) power devices can tolerate higher currents and voltages than their silicon (Si)-based counterparts. However, the realization of their superior characteristics is tied to the reliability of their packaging, where thermal management and reliable electrical insulation design are the most challenging tasks to this end. Not taking care of the former one leads to thermal runaway, and the latter one causes the electric breakdown of the whole module. In this paper, the packaging design of a 10-kV SiC diode is studied by addressing both challenges above. Electrical insulation design is carried out through a finite element method (FEM) electric field calculation model developed in COMSOL Multiphysics, meeting both the one-minute insulation and PD tests based on IEC 61287–1. Through developing an electrothermal model and for considered dimensions, an accurate estimation of the junction temperature is obtained to determine the maximum load current of the module.