A compact LTCC-based Ku-band transmitter module

A compact LTCC-based Ku-band transmitter module
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基于 LTCC 的紧凑型 Ku 波段发射器模块

DOI:
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发表时间:
2002
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通讯作者:
J. Laskar
J. Laskar
中科院分区:
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文献类型:
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作者:
Chang;A. Sutono;S. Han;K. Lim;S. Pinel;E. Tentzeris;J. Laskar

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介绍了采用标准多层低温共烧陶瓷(LTCC)技术的三维(3-D)部署射频前端系统级封装(SOP)的设计、实现和测量。在LTCC 951 AT带材上制作了一个紧凑的14 GHz GaAs MESFET发射模块,该模块集成了一个嵌入式带通滤波器。在14 GHz时,上变频MMIC集成压控振荡器(VCO),上变频增益为15 dB,IIP 3为15 dBm,功率放大器(PA)MMIC增益为31 dB,1 dB压缩输出功率为26 dBm。这两个MMIC集成在一个紧凑的LTCC模块,其中一个嵌入式前端带通滤波器(BPF),在14.25 GHz的测量插入损耗为3 dB的集成。发射机模块尺寸紧凑(400 /spl倍/ 310 /spl倍/ 35.2 mil/sup 3/),但其总体上变频增益为41 dB,可用数据速率为32 Mbps,相邻信道功率比(ACPR)为42 dB。这些结果表明,建立高度SOP集成的微波和毫米波应用的射频前端的可行性。
Presents design, implementation, and measurement of a three-dimensional (3-D)-deployed RF front-end system-on-package (SOP) in a standard multi-layer low temperature co-fired ceramic (LTCC) technology. A compact 14 GHz GaAs MESFET-based transmitter module integrated with an embedded bandpass filter was built on LTCC 951AT tapes. The up-converter MMIC integrated with a voltage controlled oscillator (VCO) exhibits a measured up-conversion gain of 15 dB and an IIP3 of 15 dBm, while the power amplifier (PA) MMIC shows a measured gain of 31 dB and a 1-dB compression output power of 26 dBm at 14 GHz. Both MMICs were integrated on a compact LTCC module where an embedded front-end band pass filter (BPF) with a measured insertion loss of 3 dB at 14.25 GHz was integrated. The transmitter module is compact in size (400 /spl times/ 310 /spl times/ 35.2 mil/sup 3/), however it demonstrated an overall up-conversion gain of 41 dB, and available data rate of 32 Mbps with adjacent channel power ratio (ACPR) of 42 dB. These results suggest the feasibility of building highly SOP integrated RF front ends for microwave and millimeter wave applications.