Current Status and Challenges for Unified Understanding of Bonding Mechanism in Solid Particle Deposition Process
Current Status and Challenges for Unified Understanding of Bonding Mechanism in Solid Particle Deposition Process
复制标题
固体颗粒沉积过程中结合机制统一认识的现状与挑战
DOI：
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发表时间：
2021
期刊：
影响因子：
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通讯作者：
K. Shinoda
中科院分区：
文献类型：
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作者：
Y. Ichikawa;K. Shinoda
冷喷涂（CS）技术是一种“不熔化的固相颗粒沉积工艺”;然而，它已被确立为一种增材制造技术，可以应用于热喷涂领域之外。这项技术的应用范围已经扩大到包括陶瓷和聚合物。除了CS之外，还有其他固体颗粒沉积工艺，例如气溶胶沉积（AD），其在材料类型、尺寸、冲击速度和目标颗粒的温度方面不同。我们可以预期，有一个共同的内在机制，通过该机制，固相颗粒连接并沉积在固相中。本文综述了冷喷涂沉积与结合机理的研究进展，认为冷喷涂沉积与结合是一种机械力化学现象，其驱动力是颗粒的变形和由此引起的颗粒表面化学状态的变化，以及短时间内的接触稳定化。当我们正确理解这些问题时，将系统地了解连接各种材料颗粒的最佳机械条件（材料尺寸和碰撞条件），并且将有可能在不熔化各种材料的情况下执行从薄膜到增材制造的不同制造工艺。[doi：10.2320/材料trans.T-M2021813]
Cold spray (CS) technology is a “solid-phase particle deposition process without melting”; however, it has been established as an additive manufacturing technology that can be applied beyond the framework of one field of thermal spraying. The scope of application of this technology has expanded to include ceramics and polymers. There are other solid particle deposition processes besides CS, such as aerosol deposition (AD), which differ in the material type, size, impact speed, and temperature of the target particles. We can expect that there is a common intrinsic mechanism through which solid-phase particles are joined and deposited in the solid phase. This review summarizes previous studies on the mechanism of cold-spray deposition and bonding, which can be understood as a mechanochemical phenomenon in part, and it is driven by the deformation of the particles and the resulting change in the chemical state of the particle surface, and stabilization by contact in a short time. When we understand these issues correctly, the optimal mechanical conditions (material size and collision conditions) for joining particles of various materials will be systematically understood, and it will be possible to perform different fabrication processes from thin films to additive manufacturing without melting various materials. [doi:10.2320/matertrans.T-M2021813]