Splat-quench solidification: estimating the maximum spreading of a droplet impacting a solid surface
Splat-quench solidification: estimating the maximum spreading of a droplet impacting a solid surface
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DOI：
10.1007/bf00400880
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发表时间：
1993-02
影响因子：
4.5
通讯作者：
T. Bennett;D. Poulikakos
中科院分区：
文献类型：
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作者：
T. Bennett;D. Poulikakos
本研究探讨了在溅射-淬火凝固过程中，决定液滴撞击固体表面的最大铺展速度的机理。本文定义了粘性耗散域和表面张力域两个区域，这两个区域由韦伯数和雷诺数表征，并由阻止碎裂扩展的主要机制来区分。本文阐述了正确确定平衡接触角(量化基材润湿性的表面张力特性)对预测基板最大铺展的重要性。考虑了在何种条件下固化碎片将有助于或将不会有助于终止碎片的扩散。然而，Oura的优先假设是，与粘性耗散和表面张力的影响相比，凝固对液滴扩散的影响(在冲击时过热)是次要的。
This study investigates the mechanisms that contribute to determining the maximum spreading of a liquid droplet impacting a solid surface in connection with splat-quench solidification. This paper defines two domains, the viscous dissipation domain and the surface tension domain, which are characterized by the Weber and the Reynolds numbers, and that are discriminated by the principal mechanism responsible for arresting the splat spreading. This paper illustrates the importance of correctly determining the equilibrium contact angle (a surface tension characteristic that quantifies the wetting of the substrate) for predicting the maximum spreading of the splat. Conditions under which solidification of the splat would or would not be expected to contribute to terminating the spreading of the splat are considered. However, oura prioriassumption is that the effect of solidification on the spreading of a droplet, superheated at impact, is secondary compared to the effects of viscous dissipation and surface tension.