Exact solution for via-plate capacitances including the finite plate thickness
Exact solution for via-plate capacitances including the finite plate thickness
复制标题
通孔板电容的精确解决方案，包括有限的板厚度
DOI：
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发表时间：
2013
期刊：
影响因子：
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通讯作者：
M. Leone
中科院分区：
文献类型：
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作者：
M. Friedrich;C. Bednarz;M. Leone
在本文中，考虑到板的有限厚度，提出了一种简单的解析解决方案，用于精确计算多层结构中的通孔板电容。电容是从静态电势分布中获得的，并导致确定无限方程系统的单个系数，该系数可以在几个未知数之后被截断。解的收敛性与板的厚度无关。因此，与省略板厚度的先前方法相比，该新颖方法不需要额外的努力。结果通过数值 3D 全波模拟得到验证。
In this paper a straightforward analytical solution is presented for the exact calculation of the via plate capacitance in multilayer structures, considering the finite thickness of the plates. The capacitance is obtained from the static potential distribution and results in the determination of a single coefficient of an infinite equation system, which can be truncated after a few unknowns. The convergence of the solution is independent of the plates thickness. Thus the novel approach does not require additional effort in comparison with previous approaches where the plate thickness is omitted. The results are validated by numerical 3D full-wave simulations.