In-situ study on growth behavior of Ag3Sn in Sn-3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology
In-situ study on growth behavior of Ag3Sn in Sn-3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology
复制标题
同步辐射实时成像技术原位研究Sn-3.5Ag/Cu焊接反应中Ag3Sn的生长行为
DOI：
10.1016/j.jallcom.2012.05.055
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发表时间：
2012-10-05
影响因子：
6.2
通讯作者：
Wang, L.
中科院分区：
文献类型：
--
作者：
Ma, H. T.;Qu, L.;Wang, L.
利用同步辐射实时成像技术对Sn-3.5Ag/Cu钎焊凝固过程中形成的Ag 3Sn金属间化合物（IMC）的生长行为进行了原位研究。观察到三种Ag 3Sn生长模式，即，直线形、Y形和X形，这主要与Ag 3Sn的晶体结构有关。线状Ag 3Sn的尺寸比其他形状的大。对于每种模式，每个方向的生长速度几乎相同。Ag 3Sn的竞争生长也被发现在凝固过程的早期阶段。Ag_3Sn大部分溶解，只有一部分能生长到最后。(C)2012 Elsevier B. V.保留所有权利。
The growth behavior of Ag3Sn intermetallic compound (IMC), forming in the Sn-3.5Ag/Cu soldering solidification process, was in situ investigated by the synchrotron radiation real-time imaging technology. Three Ag3Sn growth patterns were observed, i.e., linear, Y and X shape, which were primarily related to the crystal structure of Ag3Sn. The size of linear Ag3Sn was larger than those of other shapes. For each pattern, growth velocity of each direction was almost the same. Competitive growth of Ag3Sn was also found in the early stage of solidification process. Most of Ag3Sn were dissolved and only some of them could grow up to the end. (C) 2012 Elsevier B.V. All rights reserved.