Hot-Spot Thermal Management With Flow Modulation in a Microchannel Heat Sink
Hot-Spot Thermal Management With Flow Modulation in a Microchannel Heat Sink
复制标题
通过微通道散热器中的流量调制进行热点热管理
DOI：
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发表时间：
2005
期刊：
影响因子：
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通讯作者：
S. Garimella
中科院分区：
文献类型：
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作者：
P. Lee;S. Garimella
在微通道散热器的盖子上形成的凹槽可以用来调节流动，从而导致局部和整体的换热增强。对这种改进型微通道散热器的层流流动和换热的数值分析表明，在没有增加压降的情况下，换热得到了增强。凹槽的存在减少了整体流动摩擦，从而降低了压力降。进入凹槽的流动膨胀和随后进入下游区域的收缩导致局部换热显著增强。结果是，最高壁温和平均壁温都降低了。由于流动重新进入微通道时边界层的重新初始化，在凹槽下游区域的局部换热得到了高达150%的增强。讨论了使用该方法缓解微电子器件热点的可能性。
Recesses created in the lid of a microchannel heat sink can serve to modulate the flow, resulting in local and global heat transfer enhancement. Numerical analysis of laminar flow and heat transfer in such a modified microchannel heat sink has shown an augmentation of heat transfer without an added penalty of increased pressure drop. The presence of the recesses reduces the overall flow friction and thus pressure drop. The flow expansion into the recesses and the subsequent contraction into the downstream region causes significant local enhancement in heat transfer. Both the maximum and average wall temperatures are decreased as a result. The heat transfer is locally enhanced, by as much as 150% in the regions just downstream of the recesses due to the re-initialization of boundary layers as the flow re-enters the microchannels. The potential for hot-spot mitigation in microelectronics devices using this approach is discussed.© 2005 ASME