Roadmap for densification in cold sintering: Chemical pathways
Roadmap for densification in cold sintering: Chemical pathways
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冷烧结致密化路线图：化学途径
DOI：
10.1016/j.oceram.2020.100019
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发表时间：
2020-07-01
期刊：
影响因子：
--
通讯作者：
Randall, Clive A.
中科院分区：
文献类型：
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作者：
Ndayishimiye, Arnaud;Sengul, Mert Y.;Randall, Clive A.
冷烧结工艺（CSP）是一种能够在极低温度（T < 400 ℃）下通过施加单轴压力和瞬时溶剂实现陶瓷和复合材料致密化的技术。在实验室规模上，将直接烧结方法与CSP方法进行比较，证明后者可以实现可持续的生态制造路径，节省大量能源和排放，以及快速处理时间。到目前为止，冷烧结已应用于不同的材料，化合物，固溶体和功能复合材料，指出了多种未来的机会。本文总结了一些瞬态相选择，不同的化学方法和微妙的化学反应与粉末，可用于驱动许多重要的陶瓷和复合材料的冷烧结过程。在这样做的时候，本文强调了CSP机制的基本理解仍然具有挑战性的一些原因，但这里概述的路径分类应该有助于更全面的理解。
The cold sintering process (CSP) is a technique that enables densification of ceramics and composites at extremely low temperatures (T < 400 degrees C) with the application of a uniaxial pressure and a transient solvent. At the laboratory scale, comparing direct sintering methods relative to CSP evidences that the latter could enable a sustainable eco-manufacturing path with considerable energy and emission savings, as well as fast processing times. Thus far, cold sintering has been applied to different materials, compounds, solid solutions, and functional composites, pointing to multiple future opportunities. This paper summarizes some of the transient phase selections, different chemical approaches and subtle chemical reactions with the powders which can be used to drive the cold sintering processes in many important ceramics and composites. In doing so, this paper highlights some of the reasons why the fundamental understanding of CSP mechanisms remains challenging, but classification of the pathways as outlined here should aid progress towards a more comprehensive understanding.